Issued Patents All Time
Showing 26–42 of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7726545 | Flip chip mounting process and bump-forming process using electrically-conductive particles as nuclei | Takashi Ichiryu, Seiichi Nakatani, Yoshihiro Tomita, Koichi Hirano, Toshio Fujii | 2010-06-01 |
| 7714444 | Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same | Seiichi Nakatani, Takashi Kitae, Susumu Sawada | 2010-05-11 |
| 7689129 | System-in-package optical transceiver in optical communication with a plurality of other system-in-package optical transceivers via an optical transmission line | Seiichi Nakatani, Yoshiyuki Saito | 2010-03-30 |
| 7649267 | Package equipped with semiconductor chip and method for producing same | Tsukasa Shiraishi, Yukihiro Ishimaru, Seiichi Natkatani, Hiroki Yabe | 2010-01-19 |
| 7640659 | Method for forming conductive pattern and wiring board | Takashi Kitae, Seiichi Nakatani | 2010-01-05 |
| 7640654 | Electronic component transporting method | Seiichi Nakatani, Takashi Kitae | 2010-01-05 |
| 7638883 | Flip chip mounting method and bump forming method | Takashi Kitae, Seiichi Nakatani | 2009-12-29 |
| 7537961 | Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same | Seiichi Nakatani, Takashi Kitae, Susumu Sawada | 2009-05-26 |
| 7531387 | Flip chip mounting method and bump forming method | Takashi Kitae, Seiichi Nakatani | 2009-05-12 |
| 7531385 | Flip chip mounting method and method for connecting substrates | Takashi Kitae, Seiichi Nakatani | 2009-05-12 |
| 7531754 | Flexible substrate having interlaminar junctions, and process for producing the same | Yoshihisa Yamashita, Hiroki Yabe, Takashi Ichiryu, Seiichi Nakatani, Satoru Tomekawa +1 more | 2009-05-12 |
| 7522938 | Portable information terminal apparatus | Yoshihiro Tomita, Yasushi Nakagiri, Tsuguhiro Korenaga, Kunio Hibino, Satoru Tomekawa | 2009-04-21 |
| 7258549 | Connection member and mount assembly and production method of the same | Toshiyuki Asahi, Takashi Ichiryu, Seiichi Nakatani, Tousaku Nishiyama, Koichi Hirano +3 more | 2007-08-21 |
| 7242823 | Optical transmission channel board, board with built-in optical transmission channel, and data processing apparatus | Seiichi Nakatani, Yasuhiro Sugaya, Toshiyuki Asahi, Takashi Ichiryu | 2007-07-10 |
| 7205483 | Flexible substrate having interlaminar junctions, and process for producing the same | Yoshihisa Yamashita, Hiroki Yabe, Takashi Ichiryu, Seiichi Nakatani, Satoru Tomekawa +1 more | 2007-04-17 |
| 7184617 | Portable device | Tsuguhiro Korenaga, Kunio Hibino, Nobuki Itoh, Mikihiro Shimada, Yoshihiro Tomita +2 more | 2007-02-27 |
| 7136543 | Mount assembly, optical transmission line and photoelectric circuit board | Tousaku Nishiyama, Yukihiro Ishimaru, Yasuhiro Sugaya, Toshiyuki Asahi | 2006-11-14 |