Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11739232 | Conductive paste composition | Toyoharu Matsubara, Takamitsu ARAI, Yuta Motohisa, Kimika Gotou | 2023-08-29 |
| 10707360 | Thermosetting electroconductive paste composition, and solar cell and solar cell module both using the same | Toyoharu Matsubara, Takamitsu ARAI, Yuta Motohisa, Kimika Gotou | 2020-07-07 |
| 8604350 | Multilayer wiring substrate and manufacturing method of multilayer wiring substrate | Tsuyoshi Himori, Shogo Hirai, Hiroyuki Ishitomi, Yutaka Nakayama | 2013-12-10 |
| 8563872 | Wiring board, wiring board manufacturing method, and via paste | Shogo Hirai, Hiroyuki Ishitomi, Tsuyoshi Himori, Yutaka Nakayama | 2013-10-22 |
| 8012801 | Flip chip mounting process and flip chip assembly | Seiji Karashima, Yoshihisa Yamashita, Takashi Kitae, Seiichi Nakatani | 2011-09-06 |
| 7969741 | Substrate structure | Haruo Hayakawa, Masahiro Ono, Seiji Yamaguchi, Yoshihiro Uda, Kazuhiro Shinchi +7 more | 2011-06-28 |
| 7799607 | Process for forming bumps and solder bump | Seiji Karashima, Yoshihisa Yamashita, Takashi Kitae, Seiichi Nakatani | 2010-09-21 |
| 7773386 | Flexible substrate, multilayer flexible substrate | Yoshihisa Yamashita, Toshio Fujii, Seiichi Nakatani, Takashi Ichiryu, Hiroki Yabe | 2010-08-10 |
| 7759162 | Flip chip mounting process and flip chip assembly | Seiji Karashima, Yoshihisa Yamashita, Takashi Kitae, Seiichi Nakatani | 2010-07-20 |
| 7752749 | Electronic component mounting method and electronic component mounting device | Tsukasa Shiraishi, Yukihiro Ishimaru, Shinobu Masuda | 2010-07-13 |
| 7531754 | Flexible substrate having interlaminar junctions, and process for producing the same | Yoshihisa Yamashita, Hiroki Yabe, Takashi Ichiryu, Seiichi Nakatani, Toshio Fujii +1 more | 2009-05-12 |
| 7522938 | Portable information terminal apparatus | Yoshihiro Tomita, Yasushi Nakagiri, Tsuguhiro Korenaga, Kunio Hibino, Seiji Karashima | 2009-04-21 |
| 7321496 | Flexible substrate, multilayer flexible substrate and process for producing the same | Yoshihisa Yamashita, Toshio Fujii, Seiichi Nakatani, Takashi Ichiryu, Hiroki Yabe | 2008-01-22 |
| 7205483 | Flexible substrate having interlaminar junctions, and process for producing the same | Yoshihisa Yamashita, Hiroki Yabe, Takashi Ichiryu, Seiichi Nakatani, Toshio Fujii +1 more | 2007-04-17 |
| 7184617 | Portable device | Tsuguhiro Korenaga, Kunio Hibino, Nobuki Itoh, Mikihiro Shimada, Yoshihiro Tomita +2 more | 2007-02-27 |
| 7103971 | Process for manufacturing a circuit board | Takeshi Suzuki, Yoshihiro Kawakita, Yasushi Nakagiri, Fumio Echigo | 2006-09-12 |
| 7056571 | Wiring board and its production process | Tetsuyoshi Ogura, Hiroyoshi Tagi | 2006-06-06 |
| 7047629 | Method of manufacturing circuit board | Shinobu Kokufu, Takeshi Suzuki, Fumio Echigo, Daizo Andoh, Tatsuo Ogawa +1 more | 2006-05-23 |
| 6996902 | Method for manufacturing a circuit board | Takeshi Suzuki, Toshihiro Nishii, Fumio Echigo | 2006-02-14 |
| 6930395 | Circuit substrate having improved connection reliability and a method for manufacturing the same | Yoshihisa Yamashita, Takeshi Suzuki, Yoshihiro Kawakita, Tadashi Nakamura | 2005-08-16 |
| 6866892 | Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit board | Takeshi Suzuki, Yoshihiro Kawakita, Yasushi Nakagiri, Fumio Echigo | 2005-03-15 |
| 6774316 | Wiring board and production method thereof | Takeshi Suzuki, Tatsuo Ogawa, Yoshihiro Bessho, Tousaku Nishiyama, Tetsuyoshi Ogura | 2004-08-10 |
| 6713688 | Circuit board and its manufacture method | Shinobu Kokufu, Takeshi Suzuki, Fumio Echigo, Daizo Andoh, Tatsuo Ogawa +1 more | 2004-03-30 |
| 6691409 | Method of producing a circuit board | Takeshi Suzuki, Tatsuo Ogawa, Yoshihiro Bessho, Yasuhiro Nakatani, Yoji Ueda +3 more | 2004-02-17 |
| 6686029 | Circuit board and method for manufacturing the same | Takeshi Suzuki, Toshihiro Nishii, Fumio Echigo | 2004-02-03 |