Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8658910 | Circuit board and method of manufacturing the circuit board | Tetsuro Kubo, Tsuyoshi Himori | 2014-02-25 |
| 8604350 | Multilayer wiring substrate and manufacturing method of multilayer wiring substrate | Tsuyoshi Himori, Hiroyuki Ishitomi, Satoru Tomekawa, Yutaka Nakayama | 2013-12-10 |
| 8563872 | Wiring board, wiring board manufacturing method, and via paste | Hiroyuki Ishitomi, Tsuyoshi Himori, Satoru Tomekawa, Yutaka Nakayama | 2013-10-22 |
| 8134082 | Solid printed circuit board and method of manufacturing the same | Tadashi Nakamura, Fumio Echigo, Takayuki Kita, Kota Fukasawa | 2012-03-13 |
| 8076589 | Multilayer wiring board and its manufacturing method | Tadashi Nakamura, Fumio Echigo | 2011-12-13 |
| 7956293 | Multilayer printed wiring board and manufacturing method thereof | Fumio Echigo, Tadashi Nakamura | 2011-06-07 |
| 7510759 | Electronic part and manufacturing method thereof | Tsuyoshi Himori | 2009-03-31 |