Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8604350 | Multilayer wiring substrate and manufacturing method of multilayer wiring substrate | Tsuyoshi Himori, Shogo Hirai, Satoru Tomekawa, Yutaka Nakayama | 2013-12-10 |
| 8563872 | Wiring board, wiring board manufacturing method, and via paste | Shogo Hirai, Tsuyoshi Himori, Satoru Tomekawa, Yutaka Nakayama | 2013-10-22 |
| 7667977 | Mounting board, mounted body, and electronic equipment using the same | Yasuhiro Sugaya, Toshiyuki Asahi, Katsumasa Miki, Yoshiyuki Yamamoto, Tsuyoshi Himori | 2010-02-23 |
| 7140104 | Method of producing circuit component built-in module with embedded circuit component | Koichi Hirano, Seiichi Nakatani, Hiroyuki Handa, Tsunenori Yoshida, Yoshihisa Yamashita | 2006-11-28 |
| 7001662 | Transfer sheet and wiring board using the same, and method of manufacturing the same | Yasuhiro Sugaya, Seiichi Nakatani | 2006-02-21 |
| 6787884 | Circuit component, circuit component package, circuit component built-in module, circuit component package production and circuit component built-in module production | Koichi Hirano, Seiichi Nakatani, Hiroyuki Handa, Tsunenori Yoshida, Yoshihisa Yamashita | 2004-09-07 |