Issued Patents All Time
Showing 1–25 of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12421407 | Aqueous ink, ink cartridge and ink jet recording method | Mikio Sanada, Yoshiyuki Kaneko, Junichi Sakai, Shoichi Takeda, Hideki Yamakami | 2025-09-23 |
| 10125283 | Ink, ink cartridge, and ink jet recording method | Yojiro Kojima, Yuko Negishi | 2018-11-13 |
| 10022981 | Ink, ink cartridge, and ink jet recording method | Fumiaki Fujioka, Yuko Negishi | 2018-07-17 |
| 9956761 | Ink, ink cartridge, and ink jet recording method | Yuko Negishi, Ryuki Nanamiya, Toshiyuki Umesato | 2018-05-01 |
| 9825209 | Electronic component package and method for manufacturing the same | Kazuma Mima, Seiichi Nakatani, Koji Kawakita, Susumu Sawada | 2017-11-21 |
| 9751240 | Resin vehicle part manufacturing method and resin vehicle part | Katsuya Ikeno, Tomohiro Arakawa, Nobuyoshi Nishikawa | 2017-09-05 |
| 9627583 | Light-emitting device and method for manufacturing the same | Susumu Sawada, Seiichi Nakatani, Koji Kawakita | 2017-04-18 |
| 9595651 | Electronic component package and method for manufacturing same | Seiichi Nakatani, Koji Kawakita, Susumu Sawada | 2017-03-14 |
| 9541518 | Electrochemical detector and method for producing same | Seiichi Nakatani, Tetsuyoshi Ogura, Koichi Hirano, Makoto Takahashi, Satoshi Arimoto | 2017-01-10 |
| 9449937 | Semiconductor device and method for manufacturing the same | Koji Kawakita, Susumu Sawada, Seiichi Nakatani | 2016-09-20 |
| 9449944 | Electronic component package and method for manufacturing same | Susumu Sawada, Seiichi Nakatani, Koji Kawakita | 2016-09-20 |
| 9425122 | Electronic component package and method for manufacturing the same | Koji Kawakita, Seiichi Nakatani, Susumu Sawada | 2016-08-23 |
| 9368469 | Electronic component package and method of manufacturing same | Seiichi Nakatani, Koji Kawakita, Susumu Sawada | 2016-06-14 |
| 9330811 | Transparent electrode and method for manufacturing the same | Takashi Ichiryu, Seiichi Nakatani | 2016-05-03 |
| 9320155 | Ceramic substrate composite and method for manufacturing ceramic substrate composite | Taiji Kuroiwa, Seiichi Nakatani, Susumu Sawada | 2016-04-19 |
| 9236338 | Built-up substrate, method for manufacturing same, and semiconductor integrated circuit package | Seiichi Nakatani, Koji Kawakita, Susumu Sawada | 2016-01-12 |
| 8960879 | Ink jet ink, ink cartridge, and ink jet recording method | Takashi Saito, Tsuyoshi Furuse, Nobuyuki Matsumoto | 2015-02-24 |
| 8883617 | Method for manufacturing a metal oxide semiconductor | Kulbinder Kumar Banger, Henning Sirringhaus | 2014-11-11 |
| 8709293 | Flip-chip mounting resin composition and bump forming resin composition | Takashi Kitae, Seiji Karashima, Koichi Hirano, Toshiyuki Kojima, Seiichi Nakatani +1 more | 2014-04-29 |
| 8617943 | Method for making a semiconductor device on a flexible substrate | Takashi Ichiryu, Seiichi Nakatani, Koichi Hirano, Shingo Komatsu | 2013-12-31 |
| 8389600 | Ink jet recording method, and ink jet recording apparatus | Katsuhiko Suzuki, Katsuhiro Shirota, Hirofumi Ichinose, Masashi Tsujimura, Hiromitsu Kishi +3 more | 2013-03-05 |
| 8288778 | Semiconductor device having semiconductor elements formed inside a resin film substrate | Seiichi Nakatani, Takashi Kitae, Susumu Sawada | 2012-10-16 |
| 8283246 | Flip chip mounting method and bump forming method | Takashi Kitae, Seiichi Nakatani, Seiji Karashima, Takashi Ichiryu | 2012-10-09 |
| 8193526 | Transistor having an organic semiconductor with a hollow space | Seiichi Nakatani, Takashi Kitae, Susumu Sawada | 2012-06-05 |
| 8143617 | Semiconductor device, semiconductor device manufacturing method and image display device | Seiichi Nakatani | 2012-03-27 |