KS

Katsuhiko Suzuki

DI Disco: 18 patents #31 of 708Top 5%
KO Konica: 8 patents #304 of 1,958Top 20%
NE Nec: 7 patents #2,006 of 14,502Top 15%
HK Hamamatsu Photonics K.K.: 6 patents #340 of 1,436Top 25%
Canon: 6 patents #8,497 of 19,416Top 45%
HC Hitachi Koki Co.: 5 patents #222 of 888Top 25%
Mitsubishi Electric: 5 patents #5,859 of 25,717Top 25%
AD Advantest: 5 patents #198 of 1,193Top 20%
Nissan Motor Co.: 3 patents #2,303 of 8,689Top 30%
NA Nec Accesstechnica: 3 patents #1 of 55Top 2%
Honda Motor Co.: 2 patents #8,527 of 21,052Top 45%
RS Ricoh Printing Systems: 2 patents #64 of 200Top 35%
TA Tama-Tlo: 2 patents #1 of 42Top 3%
Ricoh Company: 2 patents #5,693 of 9,818Top 60%
SO Sony: 1 patents #17,262 of 25,231Top 70%
DE Denso: 1 patents #6,940 of 11,792Top 60%
FR Freund: 1 patents #9 of 23Top 40%
NP Nihon University, School Juridical Person: 1 patents #3 of 31Top 10%
NC Nippondenso Co.: 1 patents #1,765 of 3,479Top 55%
SC Sanyo Electric Co.: 1 patents #3,644 of 6,347Top 60%
TC Tokyo Rope Mfg. Co.: 1 patents #38 of 144Top 30%
TC Tokyo Seimitsu Co.: 1 patents #110 of 257Top 45%
Yamaha Motor: 1 patents #1,283 of 2,310Top 60%
Overall (All Time): #24,200 of 4,157,543Top 1%
77
Patents All Time

Issued Patents All Time

Showing 25 most recent of 77 patents

Patent #TitleCo-InventorsDate
12264269 Curable composition, bonded structure, and sealing structure 2025-04-01
12173939 Chiller system 2024-12-24
11819975 Workpiece processing apparatus including a resin coater and a resin grinder Shinya Watanabe, Ichiro Yamahata 2023-11-21
11764066 Peeling method for peeling off substrate from support plate 2023-09-19
11667135 Liquid discharge device and image forming device 2023-06-06
11574804 Workpiece processing and resin grinding apparatus Shinya Watanabe, Ichiro Yamahata 2023-02-07
11538710 Carrier plate removing method Takatoshi Sakurai, Yoshihiro Omuro 2022-12-27
11222808 Method of removing carrier plate 2022-01-11
11205580 Method of manufacturing molded chip 2021-12-21
11164783 Manufacturing method of semiconductor device with metal film 2021-11-02
11153975 Wiring board manufacturing method 2021-10-19
10998196 Peeling method for peeling off substrate from support plate 2021-05-04
10933618 Carrier plate removing method Takatoshi Sakurai, Hayato Kiuchi 2021-03-02
10926524 Removal method of carrier plate 2021-02-23
10899046 Composite member Takeshi Yoshida 2021-01-26
10804131 Carrier plate removing method Hayato Kiuchi 2020-10-13
10629445 Wafer processing method Hisashi Arakida, Tomoaki Sugiyama 2020-04-21
D852958 Radiation image conversion plate Jun Sakurai, Ichinobu Shimizu, Gouji Kamimura 2019-07-02
10325858 Semiconductor device chip and method of manufacturing semiconductor device chip 2019-06-18
10269724 Semiconductor package device including electromagnetic wave shield and method of manufacturing the same 2019-04-23
10115644 Interposer manufacturing method 2018-10-30
10056263 Method of processing SiC wafer 2018-08-21
9887091 Wafer processing method 2018-02-06
D806249 Radiation image conversion plate Jun Sakurai, Ichinobu Shimizu, Gouji Kamimura 2017-12-26
9417336 Radiation image conversion panel Jun Sakurai, Ichinobu Shimizu, Gouji Kamimura 2016-08-16