Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10950451 | Cutting apparatus | Hiroyuki Hiraga | 2021-03-16 |
| 10629445 | Wafer processing method | Katsuhiko Suzuki, Tomoaki Sugiyama | 2020-04-21 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10950451 | Cutting apparatus | Hiroyuki Hiraga | 2021-03-16 |
| 10629445 | Wafer processing method | Katsuhiko Suzuki, Tomoaki Sugiyama | 2020-04-21 |