Issued Patents All Time
Showing 51–75 of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7321496 | Flexible substrate, multilayer flexible substrate and process for producing the same | Toshio Fujii, Seiichi Nakatani, Takashi Ichiryu, Satoru Tomekawa, Hiroki Yabe | 2008-01-22 |
| 7314276 | Ink-jet recording method, ink-jet ink, ink-jet recording unit, ink cartridge for ink-jet recording and ink-jet recording apparatus | Shoji Koike, Kohei Watanabe, Hayato Ida | 2008-01-01 |
| 7300505 | Ink-jet recording ink, ink cartridge, recording unit, ink-jet recording method, ink-jet recording apparatus, and method for stabilizing ink ejection | Shoji Koike, Kohei Watanabe, Hayato Ida | 2007-11-27 |
| 7247178 | Capacitor and method for producing the same, and circuit board with a built-in capacitor and method for producing the same | Koichi Hirano, Tsunenori Yoshida, Hiroyuki Handa, Seiichi Nakatani | 2007-07-24 |
| 7242086 | Optical semiconductor bare chip, printed wiring board, lighting unit and lighting device | Tetsushi Tamura, Tatsumi Setomoto, Nobuyuki Matsui, Masanori Shimizu | 2007-07-10 |
| 7241333 | Ink-jet recording method, ink-jet ink, ink-jet recording unit, ink cartridge for ink-jet recording and ink-jet recording apparatus | Shoji Koike, Kohei Watanabe, Hayato Ida | 2007-07-10 |
| 7205483 | Flexible substrate having interlaminar junctions, and process for producing the same | Hiroki Yabe, Takashi Ichiryu, Seiichi Nakatani, Satoru Tomekawa, Toshio Fujii +1 more | 2007-04-17 |
| 7140104 | Method of producing circuit component built-in module with embedded circuit component | Koichi Hirano, Seiichi Nakatani, Hiroyuki Handa, Tsunenori Yoshida, Hiroyuki Ishitomi | 2006-11-28 |
| 7126811 | Capacitor and method for producing the same, and circuit board with a built-in capacitor and method for producing the same | Koichi Hirano, Tsunenori Yoshida, Hiroyuki Handa, Seiichi Nakatani | 2006-10-24 |
| 7087467 | Lead frame and production process thereof and production process of thermally conductive substrate | Koichi Hirano, Seiichi Nakatani, Masaki Suzumura | 2006-08-08 |
| 7059042 | Method of manufacturing a thermal conductive circuit board with grounding pattern connected to a heat sink | Koichi Hirano, Seiichi Nakatani, Mitsuhiro Matsuo | 2006-06-13 |
| 7041535 | Power module and method of manufacturing the same | Koichi Hirano, Seiichi Nakatani | 2006-05-09 |
| 7033865 | Thermally conductive substrate, thermally conductive substrate manufacturing method and power module | Koichi Hirano, Seiichi Nakatani, Mitsuhiro Matsuo | 2006-04-25 |
| 7022276 | Method for manufacturing circuit board and circuit board and power conversion module using the same | Koichi Hirano, Seiichi Nakatani | 2006-04-04 |
| 6964700 | Ink for use in ink jet recording and ink jet recording method utilizing the same | Ayako Uji, Noribumi Koitabashi, Ryota Kato, Takeshi Miyazaki, Yasunori Fujimoto | 2005-11-15 |
| 6958535 | Thermal conductive substrate and semiconductor module using the same | Koichi Hirano, Seiichi Nakatani | 2005-10-25 |
| 6936774 | Wiring substrate produced by transfer material method | Yasuhiro Sugaya, Shingo Komatsu, Koichi Hirano, Seiichi Nakatani, Yasuyuki Matsuoka +1 more | 2005-08-30 |
| 6930395 | Circuit substrate having improved connection reliability and a method for manufacturing the same | Satoru Tomekawa, Takeshi Suzuki, Yoshihiro Kawakita, Tadashi Nakamura | 2005-08-16 |
| 6921433 | Aqueous dispersion of water-insoluble-colorant-containing particle and preparation process thereof, water-insoluble-colorant-containing particle and preparation process thereof, and ink | Hideto Kuribayashi, Akio Kashiwazaki, Masashi Hirose, Takeshi Miyazaki | 2005-07-26 |
| 6871396 | Transfer material for wiring substrate | Yasuhiro Sugaya, Shingo Komatsu, Koichi Hirano, Seiichi Nakatani, Yasuyuki Matsuoka +1 more | 2005-03-29 |
| 6870244 | Lead frame and production process thereof and production process of thermally conductive substrate | Koichi Hirano, Seiichi Nakatani, Masaki Suzumura | 2005-03-22 |
| 6860004 | Method of manufacturing a thermally conductive circuit board with a ground pattern connected to a heat sink | Koichi Hirano, Seiichi Nakatani, Mitsuhiro Matsuo | 2005-03-01 |
| 6787884 | Circuit component, circuit component package, circuit component built-in module, circuit component package production and circuit component built-in module production | Koichi Hirano, Seiichi Nakatani, Hiroyuki Handa, Tsunenori Yoshida, Hiroyuki Ishitomi | 2004-09-07 |
| 6707671 | Power module and method of manufacturing the same | Koichi Hirano, Seiichi Nakatani | 2004-03-16 |
| 6700182 | Thermally conductive substrate, thermally conductive substrate manufacturing method and power module | Koichi Hirano, Seiichi Nakatani, Mitsuhiro Matsuo | 2004-03-02 |