Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10927198 | Methacrylic acid ester polymer, method for producing same, active energy ray-curable composition, and optical recording medium | Shinichirou Izumi, Masahiko Morooka, Kazuyoshi Odaka, Seiji Nushi, Kana Akeda +1 more | 2021-02-23 |
| 10186363 | Magnetic component unit | Hiroshi Akamatsu | 2019-01-22 |
| 8981019 | Method for producing methacrylic-based polymer | Hisaaki Yoshimura, Masahiro Hayashida, Daisuke Nonaka, Yusuke Morita | 2015-03-17 |
| 8877879 | Apparatus for producing methacrylic polymer and production method thereof | Masahiro Hayashida, Hisaaki Yoshimura, Daisuke Nonaka, Yusuke Morita | 2014-11-04 |
| 8422844 | Plastic optical fiber cable and method of transmitting signal | Yoshihiro Tsukamoto, Tsuyoshi Kimura, Yasushi Fujishige, Rie Akihara | 2013-04-16 |
| 7839128 | Bidirectional power supply device | Koji Yoshida, Hiroyuki Handa | 2010-11-23 |
| 7830035 | Power supply unit | Koji Yoshida, Hiroyuki Handa, Masafumi Nakamura, Takaharu Murakami | 2010-11-09 |
| 7816806 | Power supply device | Koji Yoshida, Hiroyuki Handa | 2010-10-19 |
| 7679337 | Power supply system | Koji Yoshida, Hiroyuki Handa | 2010-03-16 |
| 7400519 | Switching power supply | Koji Yoshida, Satoshi Ikeda, Yoshihiro Takeshima | 2008-07-15 |
| 7351931 | Switching power supply apparatus and electronic device using the same | Koji Yoshida, Yoshihiro Takeshima | 2008-04-01 |
| 7059042 | Method of manufacturing a thermal conductive circuit board with grounding pattern connected to a heat sink | Koichi Hirano, Seiichi Nakatani, Yoshihisa Yamashita | 2006-06-13 |
| 7057896 | Power module and production method thereof | Hiroyuki Handa, Koji Yoshida, Satoshi Ikeda, Yoshihiro Takeshima | 2006-06-06 |
| 7046532 | Switching power supply | Koji Yoshida | 2006-05-16 |
| 7038310 | Power module with improved heat dissipation | Seiichi Nakatani, Koichi Hirano, Hiroyuki Handa | 2006-05-02 |
| 7033865 | Thermally conductive substrate, thermally conductive substrate manufacturing method and power module | Yoshihisa Yamashita, Koichi Hirano, Seiichi Nakatani | 2006-04-25 |
| 6972656 | Switching power supply device | Yoshihiro Takeshima, Koji Yoshida, Satoshi Ikeda | 2005-12-06 |
| 6970367 | Switching power supply | Yoshihiro Takeshima, Koji Yoshida, Satoshi Ikeda | 2005-11-29 |
| 6860004 | Method of manufacturing a thermally conductive circuit board with a ground pattern connected to a heat sink | Koichi Hirano, Seiichi Nakatani, Yoshihisa Yamashita | 2005-03-01 |
| 6700182 | Thermally conductive substrate, thermally conductive substrate manufacturing method and power module | Yoshihisa Yamashita, Koichi Hirano, Seiichi Nakatani | 2004-03-02 |
| 6570099 | Thermal conductive substrate and the method for manufacturing the same | Koichi Hirano, Seiichi Nakatani, Hiroyuki Handa, Yoshihisa Yamashita | 2003-05-27 |
| 6522555 | Thermally conductive board, method of manufacturing the same, and power module with the same incorporated therein | Koichi Hirano, Seiichi Nakatani, Yoshihisa Yamashita | 2003-02-18 |
| 5288948 | Structure of a semiconductor chip having a conductive layer | Yasuhiro Fukuda, Tetsuhiko Sugahara, Norio Hirashita, Minoru Saito, Masayuki Kobayakawa +1 more | 1994-02-22 |