Issued Patents All Time
Showing 26–50 of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8071425 | Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus | Seiichi Nakatani, Takashi Kitae, Takashi Ichiryu, Seiji Karashima | 2011-12-06 |
| 8039307 | Mounted body and method for manufacturing the same | Toshiyuki Kojima, Seiichi Nakatani, Takashi Kitae, Shingo Komatsu | 2011-10-18 |
| 8012801 | Flip chip mounting process and flip chip assembly | Seiji Karashima, Satoru Tomekawa, Takashi Kitae, Seiichi Nakatani | 2011-09-06 |
| 8011777 | Ink set, ink jet recording method, ink cartridge, recording unit, and ink jet recording apparatus | Kenji Nishiguchi, Aki Takano | 2011-09-06 |
| 7981528 | Magnetic sheet with stripe-arranged magnetic grains, RFID magnetic sheet, magnetic shielding sheet and method of manufacturing the same | Seiichi Nakatani, Takashi Ichiryu, Koichi Hirano | 2011-07-19 |
| 7977741 | Manufacturing method of flexible semiconductor device and flexible semiconductor device | Koichi Hirano, Seiichi Nakatani, Shingo Komatsu, Takashi Ichiryu | 2011-07-12 |
| 7959280 | Ink-jet recording method, ink-jet ink, ink-jet recording unit, ink cartridge for ink-jet recording and ink-jet recording apparatus | Shoji Koike, Kohei Watanabe, Hayato Ida | 2011-06-14 |
| 7951700 | Flip chip mounting method and bump forming method | Takashi Kitae, Seiichi Nakatani, Seiji Karashima, Takashi Ichiryu | 2011-05-31 |
| 7921551 | Electronic component mounting method | Seiji Karashima, Takashi Kitae, Seiichi Nakatani, Toshiyuki Kojima, Shingo Komatsu | 2011-04-12 |
| 7911064 | Mounted body and method for manufacturing the same | Shingo Komatsu, Seiichi Nakatani, Seiji Karashima, Toshiyuki Kojima, Takashi Kitae | 2011-03-22 |
| 7909449 | Ink jet recording apparatus and ink jet recording method | Shin Sato, Hideki Takayama, Kenji Nishiguchi, Aki Takano | 2011-03-22 |
| 7888789 | Transfer material used for producing a wiring substrate | Yasuhiro Sugaya, Shingo Komatsu, Koichi Hirano, Seiichi Nakatani, Yasuyuki Matsuoka +1 more | 2011-02-15 |
| 7875496 | Flip chip mounting method, flip chip mounting apparatus and flip chip mounting body | Seiichi Nakatani, Seiji Karashima, Takashi Kitae, Takashi Ichiryu | 2011-01-25 |
| 7851281 | Manufacturing method of flexible semiconductor device and flexible semiconductor device | Koichi Hirano, Seiichi Nakatani, Shingo Komatsu, Takashi Ichiryu | 2010-12-14 |
| 7799607 | Process for forming bumps and solder bump | Seiji Karashima, Satoru Tomekawa, Takashi Kitae, Seiichi Nakatani | 2010-09-21 |
| 7773386 | Flexible substrate, multilayer flexible substrate | Toshio Fujii, Seiichi Nakatani, Takashi Ichiryu, Satoru Tomekawa, Hiroki Yabe | 2010-08-10 |
| 7759162 | Flip chip mounting process and flip chip assembly | Seiji Karashima, Satoru Tomekawa, Takashi Kitae, Seiichi Nakatani | 2010-07-20 |
| 7731346 | Ink-jet recording method, ink-jet ink, ink-jet recording unit, ink cartridge for ink-jet recording and ink-jet recording apparatus | Shoji Koike, Kohei Watanabe, Hayato Ida | 2010-06-08 |
| 7732920 | Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus | Seiichi Nakatani, Takashi Kitae, Takashi Ichiryu, Seiji Karashima | 2010-06-08 |
| 7713787 | Mounted body and method for manufacturing the same | Toshiyuki Kojima, Seiichi Nakatani, Takashi Kitae, Shingo Komatsu | 2010-05-11 |
| 7671464 | Lighting device having a lighting unit with an optical semiconductor bare chip mounted on printed wiring board | Tetsushi Tamura, Tatsumi Setomoto, Nobuyuki Matsui, Masanori Shimizu | 2010-03-02 |
| 7611040 | Method for forming solder bump and method for mounting semiconductor device using a solder powder resin composition | Takashi Kitae, Seiichi Nakatani, Toshiyuki Kojima, Shingo Komatsu | 2009-11-03 |
| 7560236 | Microbial community analysis | Yoshio Nakano, Toru Takeshita | 2009-07-14 |
| 7531754 | Flexible substrate having interlaminar junctions, and process for producing the same | Hiroki Yabe, Takashi Ichiryu, Seiichi Nakatani, Satoru Tomekawa, Toshio Fujii +1 more | 2009-05-12 |
| 7394663 | Electronic component built-in module and method of manufacturing the same | Koichi Hirano, Yasuhiro Sugaya, Toshiyuki Asahi, Seiichi Nakatani | 2008-07-01 |