Issued Patents All Time
Showing 25 most recent of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9426899 | Electronic component assembly | Seiichi Nakatani, Seiji Karashima | 2016-08-23 |
| 8887383 | Electrode structure and method for forming bump | Yasushi Taniguchi, Seiichi Nakatani, Seiji Karashima, Kenichi Hotehama | 2014-11-18 |
| 8709293 | Flip-chip mounting resin composition and bump forming resin composition | Seiji Karashima, Koichi Hirano, Toshiyuki Kojima, Seiichi Nakatani, Shingo Komatsu +1 more | 2014-04-29 |
| 8501583 | Method for connecting between substrates, flip-chip mounting structure, and connection structure between substrates | Seiji Karashima, Susumu Sawada, Seiichi Nakatani | 2013-08-06 |
| 8297488 | Bump forming method using self-assembling resin and a wall surface | Seiji Karashima, Yasushi Taniguchi, Seiichi Nakatani, Kenichi Hotehama, Susumu Sawada | 2012-10-30 |
| 8288778 | Semiconductor device having semiconductor elements formed inside a resin film substrate | Seiichi Nakatani, Yoshihisa Yamashita, Susumu Sawada | 2012-10-16 |
| 8283246 | Flip chip mounting method and bump forming method | Seiichi Nakatani, Seiji Karashima, Yoshihisa Yamashita, Takashi Ichiryu | 2012-10-09 |
| 8193526 | Transistor having an organic semiconductor with a hollow space | Seiichi Nakatani, Yoshihisa Yamashita, Susumu Sawada | 2012-06-05 |
| 8097958 | Flip chip connection structure having powder-like conductive substance and method of producing the same | Susumu Sawada, Seiichi Nakatani, Seiji Karashima | 2012-01-17 |
| 8071425 | Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus | Seiichi Nakatani, Yoshihisa Yamashita, Takashi Ichiryu, Seiji Karashima | 2011-12-06 |
| 8039307 | Mounted body and method for manufacturing the same | Toshiyuki Kojima, Seiichi Nakatani, Yoshihisa Yamashita, Shingo Komatsu | 2011-10-18 |
| 8012801 | Flip chip mounting process and flip chip assembly | Seiji Karashima, Yoshihisa Yamashita, Satoru Tomekawa, Seiichi Nakatani | 2011-09-06 |
| 7951700 | Flip chip mounting method and bump forming method | Seiichi Nakatani, Seiji Karashima, Yoshihisa Yamashita, Takashi Ichiryu | 2011-05-31 |
| 7921551 | Electronic component mounting method | Yoshihisa Yamashita, Seiji Karashima, Seiichi Nakatani, Toshiyuki Kojima, Shingo Komatsu | 2011-04-12 |
| 7919357 | Method for mutually connecting substrates, flip chip mounting body, and mutual connection structure between substrates | Susumu Sawada, Seiichi Nakatani, Seiji Karashima | 2011-04-05 |
| 7911064 | Mounted body and method for manufacturing the same | Shingo Komatsu, Seiichi Nakatani, Seiji Karashima, Toshiyuki Kojima, Yoshihisa Yamashita | 2011-03-22 |
| 7905011 | Bump forming method and bump forming apparatus | Yasushi Taniguchi, Seiichi Nakatani, Seiji Karashima, Susumu Matsuoka, Masayoshi Koyama | 2011-03-15 |
| 7875496 | Flip chip mounting method, flip chip mounting apparatus and flip chip mounting body | Seiichi Nakatani, Seiji Karashima, Yoshihisa Yamashita, Takashi Ichiryu | 2011-01-25 |
| 7820021 | Flip chip mounting method and method for connecting substrates | Seiji Karashima, Seiichi Nakatani | 2010-10-26 |
| 7799607 | Process for forming bumps and solder bump | Seiji Karashima, Yoshihisa Yamashita, Satoru Tomekawa, Seiichi Nakatani | 2010-09-21 |
| 7759162 | Flip chip mounting process and flip chip assembly | Seiji Karashima, Yoshihisa Yamashita, Satoru Tomekawa, Seiichi Nakatani | 2010-07-20 |
| 7732920 | Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus | Seiichi Nakatani, Yoshihisa Yamashita, Takashi Ichiryu, Seiji Karashima | 2010-06-08 |
| 7714444 | Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same | Seiichi Nakatani, Seiji Karashima, Susumu Sawada | 2010-05-11 |
| 7713787 | Mounted body and method for manufacturing the same | Toshiyuki Kojima, Seiichi Nakatani, Yoshihisa Yamashita, Shingo Komatsu | 2010-05-11 |
| 7640659 | Method for forming conductive pattern and wiring board | Seiji Karashima, Seiichi Nakatani | 2010-01-05 |