| 9426899 |
Electronic component assembly |
Seiichi Nakatani, Seiji Karashima |
2016-08-23 |
|
| 8887383 |
Electrode structure and method for forming bump |
Yasushi Taniguchi, Seiichi Nakatani, Seiji Karashima, Kenichi Hotehama |
2014-11-18 |
|
| 8709293 |
Flip-chip mounting resin composition and bump forming resin composition |
Seiji Karashima, Koichi Hirano, Toshiyuki Kojima, Seiichi Nakatani, Shingo Komatsu +1 more |
2014-04-29 |
|
| 8501583 |
Method for connecting between substrates, flip-chip mounting structure, and connection structure between substrates |
Seiji Karashima, Susumu Sawada, Seiichi Nakatani |
2013-08-06 |
|
| 8297488 |
Bump forming method using self-assembling resin and a wall surface |
Seiji Karashima, Yasushi Taniguchi, Seiichi Nakatani, Kenichi Hotehama, Susumu Sawada |
2012-10-30 |
|
| 8288778 |
Semiconductor device having semiconductor elements formed inside a resin film substrate |
Seiichi Nakatani, Yoshihisa Yamashita, Susumu Sawada |
2012-10-16 |
$62,000 |
| 8283246 |
Flip chip mounting method and bump forming method |
Seiichi Nakatani, Seiji Karashima, Yoshihisa Yamashita, Takashi Ichiryu |
2012-10-09 |
$53,000 |
| 8193526 |
Transistor having an organic semiconductor with a hollow space |
Seiichi Nakatani, Yoshihisa Yamashita, Susumu Sawada |
2012-06-05 |
$60,000 |
| 8097958 |
Flip chip connection structure having powder-like conductive substance and method of producing the same |
Susumu Sawada, Seiichi Nakatani, Seiji Karashima |
2012-01-17 |
$79,000 |
| 8071425 |
Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus |
Seiichi Nakatani, Yoshihisa Yamashita, Takashi Ichiryu, Seiji Karashima |
2011-12-06 |
$52,000 |
| 8039307 |
Mounted body and method for manufacturing the same |
Toshiyuki Kojima, Seiichi Nakatani, Yoshihisa Yamashita, Shingo Komatsu |
2011-10-18 |
$54,000 |
| 8012801 |
Flip chip mounting process and flip chip assembly |
Seiji Karashima, Yoshihisa Yamashita, Satoru Tomekawa, Seiichi Nakatani |
2011-09-06 |
$52,000 |
| 7951700 |
Flip chip mounting method and bump forming method |
Seiichi Nakatani, Seiji Karashima, Yoshihisa Yamashita, Takashi Ichiryu |
2011-05-31 |
$112,000 |
| 7921551 |
Electronic component mounting method |
Yoshihisa Yamashita, Seiji Karashima, Seiichi Nakatani, Toshiyuki Kojima, Shingo Komatsu |
2011-04-12 |
$82,000 |
| 7919357 |
Method for mutually connecting substrates, flip chip mounting body, and mutual connection structure between substrates |
Susumu Sawada, Seiichi Nakatani, Seiji Karashima |
2011-04-05 |
$97,000 |
| 7911064 |
Mounted body and method for manufacturing the same |
Shingo Komatsu, Seiichi Nakatani, Seiji Karashima, Toshiyuki Kojima, Yoshihisa Yamashita |
2011-03-22 |
$73,000 |
| 7905011 |
Bump forming method and bump forming apparatus |
Yasushi Taniguchi, Seiichi Nakatani, Seiji Karashima, Susumu Matsuoka, Masayoshi Koyama |
2011-03-15 |
$89,000 |
| 7875496 |
Flip chip mounting method, flip chip mounting apparatus and flip chip mounting body |
Seiichi Nakatani, Seiji Karashima, Yoshihisa Yamashita, Takashi Ichiryu |
2011-01-25 |
$139,000 |
| 7820021 |
Flip chip mounting method and method for connecting substrates |
Seiji Karashima, Seiichi Nakatani |
2010-10-26 |
$134,000 |
| 7799607 |
Process for forming bumps and solder bump |
Seiji Karashima, Yoshihisa Yamashita, Satoru Tomekawa, Seiichi Nakatani |
2010-09-21 |
$94,000 |
| 7759162 |
Flip chip mounting process and flip chip assembly |
Seiji Karashima, Yoshihisa Yamashita, Satoru Tomekawa, Seiichi Nakatani |
2010-07-20 |
$105,000 |
| 7732920 |
Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus |
Seiichi Nakatani, Yoshihisa Yamashita, Takashi Ichiryu, Seiji Karashima |
2010-06-08 |
$109,000 |
| 7714444 |
Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same |
Seiichi Nakatani, Seiji Karashima, Susumu Sawada |
2010-05-11 |
$122,000 |
| 7713787 |
Mounted body and method for manufacturing the same |
Toshiyuki Kojima, Seiichi Nakatani, Yoshihisa Yamashita, Shingo Komatsu |
2010-05-11 |
$122,000 |
| 7640659 |
Method for forming conductive pattern and wiring board |
Seiji Karashima, Seiichi Nakatani |
2010-01-05 |
$200,000 |
