Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Flip chip mounting method and bump forming method

Flip chip mounting method and bump forming method

US Patent 8283246 · Granted Oct 9, 2012

Estimated economic value: $53,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Aqueous ink, ink cartridge and ink jet recording method2025
Gate drive circuit, and semiconductor breaker2025
Gate drive circuit, and semiconductor breaker2025
Bidirectional switch module and bidirectional switch2024
Bidirectional switch, electrical device, and multi-level inverter2024
Gate drive circuit, and semiconductor breaker2023
Driver circuit and switch system2023
Semiconductor device including heat-dissipating metal multilayer having differen2022
Bidirectional switch and bidirectional switch device including the switch2021
Flexible touch sensor and method of manufacturing the same2019
Ink, ink cartridge, and ink jet recording method2018
Electronic component package including sealing resin layer, metal member, cerami2018