Issued Patents All Time
Showing 1–25 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12355444 | Gate drive circuit, and semiconductor breaker | Yusuke Kinoshita, Hidetoshi Ishida | 2025-07-08 |
| 12316322 | Gate drive circuit, and semiconductor breaker | Yusuke Kinoshita, Hidetoshi Ishida | 2025-05-27 |
| 12125904 | Bidirectional switch module and bidirectional switch | Yusuke Kinoshita, Ryusuke Kanomata, Masanori Nomura, Hidetoshi Ishida | 2024-10-22 |
| 12126274 | Bidirectional switch, electrical device, and multi-level inverter | Yusuke Kinoshita, Yasuhiro Yamada, Masanori Nomura, Hidetoshi Ishida | 2024-10-22 |
| 11791803 | Gate drive circuit, and semiconductor breaker | Yusuke Kinoshita, Hidetoshi Ishida | 2023-10-17 |
| 11637552 | Driver circuit and switch system | Yusuke Kinoshita, Ryusuke Kanomata, Hidetoshi Ishida | 2023-04-25 |
| 11257733 | Semiconductor device including heat-dissipating metal multilayer having different thermal conductivity, and method for manufacturing same | Masanori Nomura, Yusuke Kinoshita, Hidetoshi Ishida, Yasuhiro Yamada | 2022-02-22 |
| 11062981 | Bidirectional switch and bidirectional switch device including the switch | Yusuke Kinoshita, Yasuhiro Yamada, Hidekazu Umeda | 2021-07-13 |
| 10228806 | Flexible touch sensor and method of manufacturing the same | Yoshihiro Tomita, Koji Kawakita, Koichi Hirano, Masanori Nomura, Susumu Sawada | 2019-03-12 |
| 10083889 | Electronic component package including sealing resin layer, metal member, ceramic substrate, and electronic component and method for manufacturing the same | Koji Kawakita, Masanori Nomura | 2018-09-25 |
| 9860979 | Stretchable flexible substrate including first insulating layer, second insulating layer, first metal layer, and second metal layer | Koji Kawakita, Masanori Nomura, Yoshihiro Tomita | 2018-01-02 |
| 9844133 | Flexible substrate including stretchable sheet | Yoshihiro Tomita, Koichi Hirano, Susumu Sawada, Koji Kawakita, Masanori Nomura | 2017-12-12 |
| 9812385 | Electronic component package including electronic component, metal member, and sealing resin | Koji Kawakita, Masanori Nomura | 2017-11-07 |
| 9330811 | Transparent electrode and method for manufacturing the same | Yoshihisa Yamashita, Seiichi Nakatani | 2016-05-03 |
| 8691683 | Flip-chip mounting method and bump formation method | Koichi Hirano, Seiji Karashima, Yoshihiro Tomita, Seiichi Nakatani | 2014-04-08 |
| 8617943 | Method for making a semiconductor device on a flexible substrate | Seiichi Nakatani, Koichi Hirano, Yoshihisa Yamashita, Shingo Komatsu | 2013-12-31 |
| 8525172 | Flexible semiconductor device | Koichi Hirano, Seiichi Nakatani, Tatsuo Ogawa, Takeshi Suzuki | 2013-09-03 |
| 8525178 | Flexible semiconductor device and method for producing the same | Seiichi Nakatani, Koichi Hirano | 2013-09-03 |
| 8367488 | Manufacturing method of flexible semiconductor device | Seiichi Nakatani, Koichi Hirano | 2013-02-05 |
| 8343822 | Flexible semiconductor device and method for manufacturing same | Koichi Hirano, Seiichi Nakatani, Tatsuo Ogawa, Takeshi Suzuki | 2013-01-01 |
| 8283246 | Flip chip mounting method and bump forming method | Takashi Kitae, Seiichi Nakatani, Seiji Karashima, Yoshihisa Yamashita | 2012-10-09 |
| 8071425 | Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus | Seiichi Nakatani, Takashi Kitae, Yoshihisa Yamashita, Seiji Karashima | 2011-12-06 |
| 8064213 | Module with a built-in component, and electronic device with the same | Toshiyuki Asahi, Seiji Karashima, Seiichi Nakatani, Tousaku Nishiyama | 2011-11-22 |
| 7981528 | Magnetic sheet with stripe-arranged magnetic grains, RFID magnetic sheet, magnetic shielding sheet and method of manufacturing the same | Seiichi Nakatani, Yoshihisa Yamashita, Koichi Hirano | 2011-07-19 |
| 7977741 | Manufacturing method of flexible semiconductor device and flexible semiconductor device | Koichi Hirano, Seiichi Nakatani, Shingo Komatsu, Yoshihisa Yamashita | 2011-07-12 |