Issued Patents All Time
Showing 26–40 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7951700 | Flip chip mounting method and bump forming method | Takashi Kitae, Seiichi Nakatani, Seiji Karashima, Yoshihisa Yamashita | 2011-05-31 |
| 7927997 | Flip-chip mounting method and bump formation method | Koichi Hirano, Seiji Karashima, Yoshihiro Tomita, Seiichi Nakatani | 2011-04-19 |
| 7910403 | Metal particles-dispersed composition and flip chip mounting process and bump-forming process using the same | Koichi Hirano, Seiji Karashima, Yoshihiro Tomita | 2011-03-22 |
| 7875496 | Flip chip mounting method, flip chip mounting apparatus and flip chip mounting body | Seiichi Nakatani, Seiji Karashima, Takashi Kitae, Yoshihisa Yamashita | 2011-01-25 |
| 7851281 | Manufacturing method of flexible semiconductor device and flexible semiconductor device | Koichi Hirano, Seiichi Nakatani, Shingo Komatsu, Yoshihisa Yamashita | 2010-12-14 |
| 7773386 | Flexible substrate, multilayer flexible substrate | Yoshihisa Yamashita, Toshio Fujii, Seiichi Nakatani, Satoru Tomekawa, Hiroki Yabe | 2010-08-10 |
| 7754529 | Flip chip mounting body and method for mounting such flip chip mounting body and bump forming method | Yoshihiro Tomita, Koichi Hirano, Seiji Karashima, Toshio Fujii | 2010-07-13 |
| 7748110 | Method for producing connection member | Toshiyuki Asahi, Seiji Karashima, Seiichi Nakatani, Tousaku Nishiyama, Koichi Hirano +3 more | 2010-07-06 |
| 7732920 | Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus | Seiichi Nakatani, Takashi Kitae, Yoshihisa Yamashita, Seiji Karashima | 2010-06-08 |
| 7726545 | Flip chip mounting process and bump-forming process using electrically-conductive particles as nuclei | Seiichi Nakatani, Seiji Karashima, Yoshihiro Tomita, Koichi Hirano, Toshio Fujii | 2010-06-01 |
| 7531754 | Flexible substrate having interlaminar junctions, and process for producing the same | Yoshihisa Yamashita, Hiroki Yabe, Seiichi Nakatani, Satoru Tomekawa, Toshio Fujii +1 more | 2009-05-12 |
| 7321496 | Flexible substrate, multilayer flexible substrate and process for producing the same | Yoshihisa Yamashita, Toshio Fujii, Seiichi Nakatani, Satoru Tomekawa, Hiroki Yabe | 2008-01-22 |
| 7258549 | Connection member and mount assembly and production method of the same | Toshiyuki Asahi, Seiji Karashima, Seiichi Nakatani, Tousaku Nishiyama, Koichi Hirano +3 more | 2007-08-21 |
| 7242823 | Optical transmission channel board, board with built-in optical transmission channel, and data processing apparatus | Seiji Karashima, Seiichi Nakatani, Yasuhiro Sugaya, Toshiyuki Asahi | 2007-07-10 |
| 7205483 | Flexible substrate having interlaminar junctions, and process for producing the same | Yoshihisa Yamashita, Hiroki Yabe, Seiichi Nakatani, Satoru Tomekawa, Toshio Fujii +1 more | 2007-04-17 |