Issued Patents All Time
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10365172 | Tactile sensor that includes two sheets each having at least either flexibility or elasticity | Yoshihiro Tomita, Koichi Hirano, Hideki Ohmae | 2019-07-30 |
| 10228806 | Flexible touch sensor and method of manufacturing the same | Yoshihiro Tomita, Koji Kawakita, Koichi Hirano, Masanori Nomura, Takashi Ichiryu | 2019-03-12 |
| 9844133 | Flexible substrate including stretchable sheet | Yoshihiro Tomita, Koichi Hirano, Koji Kawakita, Takashi Ichiryu, Masanori Nomura | 2017-12-12 |
| 9825209 | Electronic component package and method for manufacturing the same | Kazuma Mima, Seiichi Nakatani, Yoshihisa Yamashita, Koji Kawakita | 2017-11-21 |
| 9678272 | Flexible optical substrate | Yoshihiro Tomita | 2017-06-13 |
| 9627583 | Light-emitting device and method for manufacturing the same | Seiichi Nakatani, Koji Kawakita, Yoshihisa Yamashita | 2017-04-18 |
| 9595651 | Electronic component package and method for manufacturing same | Yoshihisa Yamashita, Seiichi Nakatani, Koji Kawakita | 2017-03-14 |
| 9449937 | Semiconductor device and method for manufacturing the same | Koji Kawakita, Seiichi Nakatani, Yoshihisa Yamashita | 2016-09-20 |
| 9449944 | Electronic component package and method for manufacturing same | Seiichi Nakatani, Yoshihisa Yamashita, Koji Kawakita | 2016-09-20 |
| 9425122 | Electronic component package and method for manufacturing the same | Koji Kawakita, Seiichi Nakatani, Yoshihisa Yamashita | 2016-08-23 |
| 9373762 | Electronic part package | Yoshihiro Tomita, Koji Kawakita, Masanori Nomura | 2016-06-21 |
| 9368469 | Electronic component package and method of manufacturing same | Seiichi Nakatani, Yoshihisa Yamashita, Koji Kawakita | 2016-06-14 |
| 9320155 | Ceramic substrate composite and method for manufacturing ceramic substrate composite | Taiji Kuroiwa, Seiichi Nakatani, Yoshihisa Yamashita | 2016-04-19 |
| 9236338 | Built-up substrate, method for manufacturing same, and semiconductor integrated circuit package | Seiichi Nakatani, Koji Kawakita, Yoshihisa Yamashita | 2016-01-12 |
| 8501583 | Method for connecting between substrates, flip-chip mounting structure, and connection structure between substrates | Takashi Kitae, Seiji Karashima, Seiichi Nakatani | 2013-08-06 |
| 8297488 | Bump forming method using self-assembling resin and a wall surface | Seiji Karashima, Yasushi Taniguchi, Seiichi Nakatani, Kenichi Hotehama, Takashi Kitae | 2012-10-30 |
| 8288778 | Semiconductor device having semiconductor elements formed inside a resin film substrate | Seiichi Nakatani, Yoshihisa Yamashita, Takashi Kitae | 2012-10-16 |
| 8193526 | Transistor having an organic semiconductor with a hollow space | Seiichi Nakatani, Yoshihisa Yamashita, Takashi Kitae | 2012-06-05 |
| 8097958 | Flip chip connection structure having powder-like conductive substance and method of producing the same | Seiichi Nakatani, Seiji Karashima, Takashi Kitae | 2012-01-17 |
| 8040200 | Parallel differential transmission lines having an opposing grounding conductor separated into two parts by a slot therein | Akira Minegishi, Toru Yamada, Kazuhide Uriu | 2011-10-18 |
| 7919357 | Method for mutually connecting substrates, flip chip mounting body, and mutual connection structure between substrates | Seiichi Nakatani, Seiji Karashima, Takashi Kitae | 2011-04-05 |
| 7714444 | Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same | Seiichi Nakatani, Seiji Karashima, Takashi Kitae | 2010-05-11 |
| 7537961 | Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same | Seiichi Nakatani, Seiji Karashima, Takashi Kitae | 2009-05-26 |
| 5849417 | Titanium implantation materials for the living body | Tateo Ohhashi, Ichiro Sawamura, Toshiaki Shimada | 1998-12-15 |
| 5804046 | Thin-film forming apparatus | Junichi Anan, Yoshitaka Kakutani, Hironori Wada, Fumihiko Yanagawa, Roderick C. Mosely | 1998-09-08 |