| 10047430 |
Self-ionized and inductively-coupled plasma for sputtering and resputtering |
Peijun Ding, Rong Tao, Zheng Xu, Daniel C. Lubben, Suraj Rengarajan +7 more |
2018-08-14 |
$24,993,000 |
| 8696875 |
Self-ionized and inductively-coupled plasma for sputtering and resputtering |
Peijun Ding, Rong Tao, Zheng Xu, Daniel C. Lubben, Suraj Rengarajan +7 more |
2014-04-15 |
$21,336,000 |
| 8668816 |
Self-ionized and inductively-coupled plasma for sputtering and resputtering |
Peijun Ding, Rong Tao, Zheng Xu, Daniel C. Lubben, Suraj Rengarajan +7 more |
2014-03-11 |
$12,153,000 |
| 8324095 |
Integration of ALD tantalum nitride for copper metallization |
Hua Chung, Nirmalya Maity, Jick Yu, Mei Chang |
2012-12-04 |
$6,403,000 |
| 7802480 |
Method and apparatus for the detection of high pressure conditions in a vacuum-type electrical device |
Steven Jay Randazzo |
2010-09-28 |
$5,051,000 |
| 7604708 |
Cleaning of native oxide with hydrogen-containing radicals |
Bingxi Wood, Mark Kawaguchi, James S. Papanu, Chiukun Steven Lai, Chien-Teh Kao +2 more |
2009-10-20 |
$54,871,000 |
| 7499255 |
Vacuum-type electrical switching apparatus |
James Francis Domo, Lance Sabados, Steven Jay Randazzo, Joseph E. Oeschger, Mary Montesclaros |
2009-03-03 |
$5,565,000 |
| 7497122 |
Method and apparatus for the detection of high pressure conditions in a vacuum-type electrical device |
Mary Montesclaros, Steven Jay Randazzo, Bryce Sollazzi, Robert James Speciale |
2009-03-03 |
$5,565,000 |
| 7383733 |
Method and apparatus for the sonic detection of high pressure conditions in a vacuum switching device |
Steven Jay Randazzo, Li Lei, Ernest F. Bestel |
2008-06-10 |
|
| 7313964 |
Method and apparatus for the detection of high pressure conditions in a vacuum-type electrical device |
Mary Montesclaros, Steven Jay Randazzo, Bryce Sollazzi, Robert James Speciale |
2008-01-01 |
|
| 7302854 |
Method and apparatus for the detection of high pressure conditions in a vacuum-type electrical device |
John C. Egermeier, Steven Jay Randazzo, Bryce Sollazzi |
2007-12-04 |
|
| 7048837 |
End point detection for sputtering and resputtering |
Sasson Somekh, Marc Schweitzer, John C. Forster, Zheng Xu, Barry Chin +1 more |
2006-05-23 |
$10,996,000 |
| 7049226 |
Integration of ALD tantalum nitride for copper metallization |
Hua Chung, Nirmalya Maity, Jick Yu, Mei Chang |
2006-05-23 |
$10,996,000 |
| 6933021 |
Method of TiSiN deposition using a chemical vapor deposition (CVD) process |
Jing-Pei (Connie) Chou, Chien-Teh Kao, Chiukin Lai, Mei Chang |
2005-08-23 |
$18,503,000 |
| 6905965 |
Reactive preclean prior to metallization for sub-quarter micron application |
Suchitra Subrahmanyan, Liang-Yuh Chen |
2005-06-14 |
$12,100,000 |
| 6743714 |
Low temperature integrated metallization process and apparatus |
Hong Mei Zhang, Fusen Chen, Ted Guo, Liang-Yuh Chen |
2004-06-01 |
$29,854,000 |
| 6726776 |
Low temperature integrated metallization process and apparatus |
Hong Mei Zhang, Fusen Chen, Ted Guo |
2004-04-27 |
$41,702,000 |
| 6693030 |
Reactive preclean prior to metallization for sub-quarter micron application |
Suchitra Subrahmanyan, Liang-Yuh Chen |
2004-02-17 |
$39,298,000 |
| 6607976 |
Copper interconnect barrier layer structure and formation method |
Ling Chen, Seshadri Ganguli, Christophe Marcadal, Wei Cao, Mei Chang |
2003-08-19 |
$39,032,000 |
| 6518176 |
Method of selective formation of a barrier layer for a contact level via |
Ted Guo, Liang-Yuh Chen, Suchitra Subrahmanyan |
2003-02-11 |
|
| 6509274 |
Method for forming aluminum lines over aluminum-filled vias in a semiconductor substrate |
Ted Guo, Jing-Pei (Connie) Chou, Liang-Yuh Chen |
2003-01-21 |
$45,007,000 |
| 6500742 |
Construction of a film on a semiconductor wafer |
Chyi Chern, Michal Danek, Marvin Liao, Karl A. Littau, Ivo Raaijmakers +1 more |
2002-12-31 |
$23,154,000 |
| 6458684 |
Single step process for blanket-selective CVD aluminum deposition |
Ted Guo, Liang-Yuh Chen, Mehul Naik |
2002-10-01 |
$35,783,000 |
| 6444036 |
Construction of a film on a semiconductor wafer |
Chyi Chern, Michal Danek, Marvin Liao, Karl A. Littau, Ivo Raaijmakers +1 more |
2002-09-03 |
$21,151,000 |
| 6436819 |
Nitrogen treatment of a metal nitride/metal stack |
Zhi ZHANG, David Pung, Nitin Khurana, Hong Mei Zhang |
2002-08-20 |
$16,370,000 |
