Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8956920 | Leadframe for integrated circuit die packaging in a molded package and a method for preparing such a leadframe | Tsung-Yi Wu, Tsung-Wen Chang | 2015-02-17 |
| D640668 | High definition television speaker | — | 2011-06-28 |
| D570847 | Media device docking station with a speaker | — | 2008-06-10 |
| 6500742 | Construction of a film on a semiconductor wafer | Michal Danek, Marvin Liao, Roderick C. Mosely, Karl A. Littau, Ivo Raaijmakers +1 more | 2002-12-31 |
| 6444036 | Construction of a film on a semiconductor wafer | Michal Danek, Marvin Liao, Roderick C. Mosely, Karl A. Littau, Ivo Raaijmakers +1 more | 2002-09-03 |
| 6291343 | Plasma annealing of substrates to improve adhesion | Jennifer Meng Chu Tseng, Mei Chang, Ling Chen, David Charles Smith, Karl A. Littau +1 more | 2001-09-18 |
| 6251758 | Construction of a film on a semiconductor wafer | Michal Danek, Marvin Liao, Roderick C. Mosely, Karl A. Littau, Ivo Raaijmakers +1 more | 2001-06-26 |
| 5834068 | Wafer surface temperature control for deposition of thin films | Wei-Min Chen, Marvin Liao, Jennifer Meng Chu Tseng, Mei Chang | 1998-11-10 |