| 7067869 |
Adjustable 3D capacitor |
Wei Cheng, Daniel Yen, Chit Hwei Ng |
2006-06-27 |
| 6699530 |
Method for constructing a film on a semiconductor wafer |
Michal Danek, Eric A. Englhardt, Mei Chang, Yeh-Jen Kao, Dale R. DuBois +1 more |
2004-03-02 |
| 6689643 |
Adjustable 3D capacitor |
Wei Cheng, Daniel Yen, Chit Hwei Ng |
2004-02-10 |
| 6500742 |
Construction of a film on a semiconductor wafer |
Chyi Chern, Michal Danek, Roderick C. Mosely, Karl A. Littau, Ivo Raaijmakers +1 more |
2002-12-31 |
| 6444036 |
Construction of a film on a semiconductor wafer |
Chyi Chern, Michal Danek, Roderick C. Mosely, Karl A. Littau, Ivo Raaijmakers +1 more |
2002-09-03 |
| 6291343 |
Plasma annealing of substrates to improve adhesion |
Jennifer Meng Chu Tseng, Mei Chang, Ling Chen, David Charles Smith, Karl A. Littau +1 more |
2001-09-18 |
| 6251758 |
Construction of a film on a semiconductor wafer |
Chyi Chern, Michal Danek, Roderick C. Mosely, Karl A. Littau, Ivo Raaijmakers +1 more |
2001-06-26 |
| 6155198 |
Apparatus for constructing an oxidized film on a semiconductor wafer |
Michael Danek, Eric A. Englhardt, Mei Chang, Yeh-Jen Kao, Dale R. DuBois +1 more |
2000-12-05 |
| 6127238 |
Plasma enhanced chemical vapor deposited (PECVD) silicon nitride barrier layer for high density plasma chemical vapor deposited (HDP-CVD) dielectric layer |
Kho Liep Chok, Jia Zhen Zheng, Wei-Lun LU, Yih-Shung Lin |
2000-10-03 |
| 5834068 |
Wafer surface temperature control for deposition of thin films |
Chyi Chern, Wei-Min Chen, Jennifer Meng Chu Tseng, Mei Chang |
1998-11-10 |
