Issued Patents All Time
Showing 25 most recent of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7294043 | CMP apparatus and process sequence method | Chen-Shien Chen, Yai-Yei Huang, Ming-Hsiang Kao, Winata Karta Tjandra | 2007-11-13 |
| 7271103 | Surface treated low-k dielectric as diffusion barrier for copper metallization | Kuei-Wu Huang, Ai-Sen Liu, Baw-Ching Perng, Ming-Ta Lei, Wen-Kai Wan +2 more | 2007-09-18 |
| RE39690 | Enhanced planarization technique for an integrated circuit | Alex Kalnitsky | 2007-06-12 |
| 7176137 | Method for multiple spacer width control | Baw-Ching Perng, Ming-Ta Lei, Ai-Sen Liu, Chia-Hui Lin, Cheng-Chung Lin | 2007-02-13 |
| 7118451 | CMP apparatus and process sequence method | Chen-Shien Chen, Yai-Yei Huang, Ming-Hsiang Kao, Winata Karta Tjandra | 2006-10-10 |
| 7011929 | Method for forming multiple spacer widths | Ming-Ta Lei, Ai-Sen Liu, Cheng-Chung Lin, Baw-Ching Perng, Chia-Hui Lin | 2006-03-14 |
| 7004814 | CMP process control method | Chen-Shien Chen, Yai-Yei Huang, Yean-Zhaw Chen, Kai-Hsiung Chen | 2006-02-28 |
| 6943077 | Selective spacer layer deposition method for forming spacers with different widths | Ai-Sen Liu, Baw-Ching Perng, Ming-Ta Lei, Cheng-Chung Lin, Chia-Hui Lin | 2005-09-13 |
| 6746900 | Method for forming a semiconductor device having high-K gate dielectric material | Ai-Sen Liu, Baw-Ching Perng, Ming-Ta Lei, Wen-Kai Wan, Cheng-Chung Lin +2 more | 2004-06-08 |
| 6617242 | Method for fabricating interlevel contacts of aluminum/refractory metal alloys | Fusen Chen, Fu-Tai Liou, Timothy E. Turner, Che-Chia Wei, Girish Dixit | 2003-09-09 |
| 6558739 | Titanium nitride/titanium tungsten alloy composite barrier layer for integrated circuits | Erzhuang Liu, Charles Lin | 2003-05-06 |
| 6433435 | Aluminum contact structure for integrated circuits | Fu-Tai Liou | 2002-08-13 |
| 6291344 | Integrated circuit with improved contact barrier | De-Dul Liao | 2001-09-18 |
| 6242811 | Interlevel contact including aluminum-refractory metal alloy formed during aluminum deposition at an elevated temperature | Fusen Chen, Fu-Tai Liou, Timothy E. Turner, Che-Chia Wei, Girish Dixit | 2001-06-05 |
| 6207554 | Gap filling process in integrated circuits using low dielectric constant materials | Yi Xu, Jia Zhen Zheng, Jane Hui, Charles Lin | 2001-03-27 |
| 6191033 | Method of fabricating an integrated circuit with improved contact barrier | De-Dui Liao | 2001-02-20 |
| 6183189 | Self aligning wafer chuck design for wafer processing tools | Erzhuang Lzu, Xiaosong Eric Tang, Charles Lin | 2001-02-06 |
| 6127238 | Plasma enhanced chemical vapor deposited (PECVD) silicon nitride barrier layer for high density plasma chemical vapor deposited (HDP-CVD) dielectric layer | Marvin Liao, Kho Liep Chok, Jia Zhen Zheng, Wei-Lun LU | 2000-10-03 |
| 6054390 | Grazing incident angle processing method for microelectronics layer fabrication | Erzhuang Liu, Charles Lin | 2000-04-25 |
| 5986330 | Enhanced planarization technique for an integrated circuit | Alex Kalnitsky | 1999-11-16 |
| 5976969 | Method for forming an aluminum contact | Fu-Tai Liou | 1999-11-02 |
| 5943598 | Integrated circuit with planarized dielectric layer between successive polysilicon layers | — | 1999-08-24 |
| 5930673 | Method for forming a metal contact | Fusen Chen, Fu-Tai Liou, Girish Dixit, Che-Chia Wei | 1999-07-27 |
| 5918152 | Gap filling method using high pressure | Liu Erzhuang, Charles Lin | 1999-06-29 |
| 5841195 | Semiconductor contact via structure | Lun-Tseng Lu, Fu-Tai Liou, Che-Chia Wei, John L. Walters | 1998-11-24 |