Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9054107 | Reliable interconnect for semiconductor device | Fan Zhang, Xiaomei Bu, Tae Jong Lee, Liang-Choo Hsia | 2015-06-09 |
| 8598031 | Reliable interconnect for semiconductor device | Fan Zhang, Xiaomei Bu, Tae Jong Lee, Liang-Choo Hsia | 2013-12-03 |
| 7585768 | Combined copper plating method to improve gap fill | Xiaomei Bu, Alex See, Fan Zhang, Tae Jong Lee, Liang-Choo Hsia | 2009-09-08 |
| 6207554 | Gap filling process in integrated circuits using low dielectric constant materials | Yi Xu, Jia Zhen Zheng, Charles Lin, Yih-Shung Lin | 2001-03-27 |