| 9054107 |
Reliable interconnect for semiconductor device |
Fan Zhang, Jane Hui, Tae Jong Lee, Liang-Choo Hsia |
2015-06-09 |
| 8598031 |
Reliable interconnect for semiconductor device |
Fan Zhang, Jane Hui, Tae Jong Lee, Liang-Choo Hsia |
2013-12-03 |
| 7989338 |
Grain boundary blocking for stress migration and electromigration improvement in CU interconnects |
Fan Zhang, Kho Liep Chok, Alex See, Cheng Tan, Tae Jong Lee +1 more |
2011-08-02 |
| 7585768 |
Combined copper plating method to improve gap fill |
Alex See, Fan Zhang, Jane Hui, Tae Jong Lee, Liang-Choo Hsia |
2009-09-08 |
| 7224060 |
Integrated circuit with protective moat |
Fan Zhang, Kho Liep Chok, Tae Jong Lee, Meng Luo, Chian Yuh Sin +4 more |
2007-05-29 |
| 7094669 |
Structure and method of liner air gap formation |
Alex See, Tae Jong Lee, Fan Zhang, Yeon Kheng Lim, Liang-Choo Hsia |
2006-08-22 |
| 6913994 |
Method to form Cu/OSG dual damascene structure for high performance and reliable interconnects |
Qiang Guo, Ahila Krishnamoorthy, Vladimir Bliznetsov |
2005-07-05 |