Issued Patents All Time
Showing 25 most recent of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10608046 | Integrated two-terminal device with logic device for embedded application | Wanbing Yi, Curtis Chun-I Hsieh, Juan Boon Tan, Soh Yun Siah, Hai Cong +3 more | 2020-03-31 |
| 10446607 | Integrated two-terminal device with logic device for embedded application | Wanbing Yi, Curtis Chun-I Hsieh, Juan Boon Tan, Soh Yun Siah, Hai Cong +3 more | 2019-10-15 |
| 10410854 | Method and device for reducing contamination for reliable bond pads | Honghui Mou, Xiaodong Li, Yun Ling Tan, Liang Li | 2019-09-10 |
| 10115625 | Methods for removal of hard mask | Liang Li, Yun Ling Tan, Hai Cong, Changwei Pei | 2018-10-30 |
| 10103097 | CD control | Zheng Zou, Huang Liu, Hai Cong | 2018-10-16 |
| 9646934 | Integrated circuits with overlay marks and methods of manufacturing the same | Shijie Wang, Yong Feng Fu, Siew Yong Leong, Lei Wang | 2017-05-09 |
| 9620418 | Methods for fabricating integrated circuits with improved active regions | Liang Li, Wei Lu, Lian Choo Goh, Yung Fu Chong, Fangyue Liu | 2017-04-11 |
| 9548371 | Integrated circuits having nickel silicide contacts and methods for fabricating the same | Jingyan Huang, Chuan-Hua Wang, Chim Seng Seet, Yun Ling Tan | 2017-01-17 |
| 9543502 | Small pitch and high density contact array | Zheng Zou | 2017-01-10 |
| 9537092 | Integrated circuits with memory cells and methods of manufacturing the same | Zheng Zou, Shyue Seng Tan | 2017-01-03 |
| 9520371 | Planar passivation for pads | Benfu Lin, Wanbing Yi, Wei Lu, Juan Boon Tan | 2016-12-13 |
| 9511474 | CMP head structure with retaining ring | Benfu Lin, Wei Lu | 2016-12-06 |
| 9511470 | CMP head structure with retaining ring | Benfu Lin, Lei Wang, Xuesong Rao, Wei Lu | 2016-12-06 |
| 9437547 | Through silicon vias | Benfu Lin, Hong-Chi Yu, Lup San Leong, Wei Lu | 2016-09-06 |
| 9287197 | Through silicon vias | Benfu Lin, Hong-Chi Yu, Lup San Leong, Wei Lu | 2016-03-15 |
| 9209275 | Integrated circuits with memory cells and methods of manufacturing the same | Zheng Zou | 2015-12-08 |
| 9202746 | Integrated circuits with improved gap fill dielectric and methods for fabricating same | Lei Wang, Lup San Leong, Wei Lu | 2015-12-01 |
| 8912102 | Laser annealing | Chyiu Hyia Poon, Meisheng Zhou | 2014-12-16 |
| 8860142 | Method and apparatus to reduce thermal variations within an integrated circuit die using thermal proximity correction | Debora Chyiu Hyia Poon, Francis Benistant, Benjamin Colombeau, Yun Ling Tan, Mei Sheng Zhou +1 more | 2014-10-14 |
| 8754447 | Strained channel transistor structure and method | Jin Ping Liu, Mei Sheng Zhou, Liang-Choo Hsia | 2014-06-17 |
| 8716076 | Method for fabricating a semiconductor device having an epitaxial channel and transistor having same | Jinping Liu, Mei Sheng Zhou, Liang-Choo Hsia | 2014-05-06 |
| 8546873 | Integrated circuit and method of fabrication thereof | Jinping Liu, Hai Cong, Binbin Zhou, Mei Sheng Zhou, Liang-Choo Hsia | 2013-10-01 |
| 8324011 | Implementation of temperature-dependent phase switch layer for improved temperature uniformity during annealing | Chyiu Hyia Poon, Mei Sheng Zhou | 2012-12-04 |
| 8293544 | Method and apparatus to reduce thermal variations within an integrated circuit die using thermal proximity correction | Debora Chyiu Hyia Poon, Francis Benistant, Benjamin Colombeau, Yun Ling Tan, Mei Sheng Zhou +1 more | 2012-10-23 |
| 8058123 | Integrated circuit and method of fabrication thereof | Jinping Liu, Hai Cong, Binbin Zhou, Mei Sheng Zhou, Liang-Choo Hsia | 2011-11-15 |