Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12284924 | Programmable interposer using RRAM platform | Juan Boon Tan, Benfu Lin, Yi Jiang | 2025-04-22 |
| 11744085 | Semiconductor devices and methods of forming semiconductor devices with logic and memory regions insulation layers | Benfu Lin, Yi Jiang, Juan Boon Tan | 2023-08-29 |
| 11641789 | Memory cells and methods for forming memory cells | Yi Jiang, Benfu Lin, Curtis Chun-I Hsieh, Wanbing Yi, Juan Boon Tan | 2023-05-02 |
| 11289649 | Non-volatile memory elements with a narrowed electrode | Curtis Chun-I Hsieh, Juan Boon Tan, Eng Huat Toh, Kin Wai Tang | 2022-03-29 |
| 10475990 | Pillar contact extension and method for producing the same | Curtis Chun-I Hsieh, Wanbing Yi, Cing Gie Lim, Yi Jiang, Juan Boon Tan | 2019-11-12 |
| 9437547 | Through silicon vias | Benfu Lin, Hong-Chi Yu, Alex See, Wei Lu | 2016-09-06 |
| 9287197 | Through silicon vias | Benfu Lin, Hong-Chi Yu, Alex See, Wei Lu | 2016-03-15 |
| 9230886 | Method for forming through silicon via with wafer backside protection | Zheng Zou, Alex See, Hai Cong, Xuesong Rao, Yun Ling Tan +1 more | 2016-01-05 |
| 9202746 | Integrated circuits with improved gap fill dielectric and methods for fabricating same | Lei Wang, Wei Lu, Alex See | 2015-12-01 |
| 9076735 | Methods for fabricating integrated circuits using chemical mechanical polishing | Alan Cing Gie Lim, Ling Wu, Jian Yang | 2015-07-07 |
| 8940637 | Method for forming through silicon via with wafer backside protection | Zheng Zou, Alex See, Hai Cong, Xuesong Rao, Yun Ling Tan +1 more | 2015-01-27 |
| 8828858 | Spacer profile engineering using films with continuously increased etch rate from inner to outer surface | Xuesong Rao, Chim Seng Seet, Hai Cong, Zheng Zou, Alex See +2 more | 2014-09-09 |
| 8492236 | Step-like spacer profile | Xuesong Rao, Chim Seng Seet, Hai Cong, Zheng Zou, Alex See +3 more | 2013-07-23 |
| 7947604 | Method for corrosion prevention during planarization | Fan Zhang, Yong Kong Siew, Bei Chao Zhang | 2011-05-24 |
| 7833900 | Interconnections for integrated circuits including reducing an overburden and annealing | Yong Kong Siew, Liang-Choo Hsia | 2010-11-16 |
| 7156726 | Polishing apparatus and method for forming an integrated circuit | Feng Chen, Charles Lin | 2007-01-02 |
| 6964598 | Polishing apparatus and method for forming an integrated circuit | Feng Chen, Charles Lin | 2005-11-15 |
| 6730573 | MIM and metal resistor formation at CU beol using only one extra mask | Chit Hwei Ng, Chaw Sing Ho, Shao Kai, Raymond Joy, Sanford Chu +1 more | 2004-05-04 |
| 6443809 | Polishing apparatus and method for forming an integrated circuit | Feng Chen, Charles Lin | 2002-09-03 |
| 6376378 | Polishing apparatus and method for forming an integrated circuit | Feng Chen, Charles Lin | 2002-04-23 |