YJ

Yi Jiang

GP Globalfoundries Singapore Pte.: 38 patents #9 of 828Top 2%
LT Loctek Visual Technology: 2 patents #4 of 11Top 40%
EH E Ink Holdings: 1 patents #459 of 639Top 75%
📍 Singapore, SG: #100 of 13,971 inventorsTop 1%
Overall (All Time): #75,016 of 4,157,543Top 2%
41
Patents All Time

Issued Patents All Time

Showing 1–25 of 41 patents

Patent #TitleCo-InventorsDate
12284924 Programmable interposer using RRAM platform Lup San Leong, Juan Boon Tan, Benfu Lin 2025-04-22
11978510 Memory devices and methods of forming the same Curtis Chun-I Hsieh, Wei-Hui Hsu, Wanbing Yi, Kai Kang, Juan Boon Tan 2024-05-07
11744085 Semiconductor devices and methods of forming semiconductor devices with logic and memory regions insulation layers Benfu Lin, Lup San Leong, Juan Boon Tan 2023-08-29
11641789 Memory cells and methods for forming memory cells Benfu Lin, Lup San Leong, Curtis Chun-I Hsieh, Wanbing Yi, Juan Boon Tan 2023-05-02
11515475 Resistive random access memory devices Curtis Chun-I Hsieh, Wei-Hui Hsu, Wanbing Yi, Kai Kang, Juan Boon Tan 2022-11-29
11270938 Semiconductor devices and methods of forming semiconductor devices Kai Kang, Curtis Chun-I Hsieh, Wanbing Yi, Juan Boon Tan 2022-03-08
11233195 Memory devices and methods of forming memory devices Curtis Chun-I Hsieh, Wei-Hui Hsu, Kai Kang, Wanbing Yi, Juan Boon Tan 2022-01-25
11127784 Integrated circuits with embedded memory structures and methods for fabricating the same Curtis Chun-I Hsieh, Wanbing Yi, Juan Boon Tan 2021-09-21
11127459 Memory devices and methods of forming the same Curtis Chun-I Hsieh, Wei-Hui Hsu, Wanbing Yi, Kai Kang, Juan Boon Tan 2021-09-21
11081523 Memory devices and methods of forming memory devices Curtis Chun-I Hsieh, Wei-Hui Hsu, Wanbing Yi, Juan Boon Tan 2021-08-03
11031251 Self-aligned planarization of low-k dielectrics and method for producing the same Curtis Chun-I Hsieh, Wanbing Yi, Juan Boon Tan, Zhehui Wang 2021-06-08
10734444 Integrated circuits with integrated memory structures and capacitors and methods for fabricating the same Curtis Chun-I Hsieh, Wanbing Yi, Juan Boon Tan 2020-08-04
10734572 Device with capping layer for improved residue defect and method of production thereof Curtis Chun-I Hsieh, Wanbing Yi, Juan Boon Tan 2020-08-04
10720580 RRAM device and method of fabrication thereof Curtis Chun-I Hsieh, Wei-Hui Hsu, Wanbing Yi, Juan Boon Tan 2020-07-21
10693054 MTJ bottom metal via in a memory cell and method for producing the same Danny Pak-Chum Shum, Wanbing Yi, Curtis Chun-I Hsieh, Juan Boon Tan, Benfu Lin 2020-06-23
10651380 Memory devices and methods of forming the same Curtis Chun-I Hsieh, Wei-Hui Hsu, Wanbing Yi, Juan Boon Tan 2020-05-12
10629650 Integrated circuits with memory cells and methods for producing the same Hongxi Liu, Baolei Wu, Narayanapillai Kulothungasagaran, Subash Pattabiraman Lakshmipathi, Yew Tuck Chow +3 more 2020-04-21
10593728 Integrated circuits and methods for fabricating integrated circuits with magnetic tunnel junction (MTJ) structures Curtis Chun-I Hsieh, Wanbing Yi, Juan Boon Tan 2020-03-17
10580968 Integrated circuit with memory cells having reliable interconnection Wanbing Yi, Curtis Chun-I Hsieh, Juan Boon Tan 2020-03-03
10483461 Embedded MRAM in interconnects and method for producing the same Wanbing Yi, Curtis Chun-I Hsieh, Bharat Bhushan, Mahesh Bhatkar, Juan Boon Tan 2019-11-19
10475990 Pillar contact extension and method for producing the same Curtis Chun-I Hsieh, Lup San Leong, Wanbing Yi, Cing Gie Lim, Juan Boon Tan 2019-11-12
10461247 Integrated magnetic random access memory with logic device having low-K interconnects Danny Pak-Chum Shum, Juan Boon Tan, Wanbing Yi, Francis Poh, Hai Cong 2019-10-29
10381403 MRAM device with improved seal ring and method for producing the same Bharat Bhushan, Curtis Chun-I Hsieh, Mahesh Bhatkar, Wanbing Yi, Juan Boon Tan 2019-08-13
10381404 Integrated circuits with memory cells and methods for producing the same Bhushan Bharat, Juan Boon Tan, Danny Pak-Chum Shum, Wanbing Yi 2019-08-13
10290679 High-Density STT-MRAM with 3D arrays of MTJs in multiple levels of interconnects and method for producing the same Bharat Bhushan, Juan Boon Tan, Danny Pak-Chum Shum, Wanbing Yi 2019-05-14