| 12369635 |
Vaporizer and ceramic vaporization core thereof and method for fabricating ceramic vaporization core |
Hongming ZHOU, Bo Li, Shaobin XIANG, Jicai LONG |
2025-07-29 |
|
| 12313183 |
Controller for electromagnetic valve, water treatment device and gas cooker |
Shanyu Zhang, Guanghua Li |
2025-05-27 |
|
| 12122724 |
Composite ceramic member and method for preparation thereof, vaporization assembly, and electronic cigarette |
Bo Li |
2024-10-22 |
|
| 12077459 |
Device and method for mud solidification based on electro-osmosis well points cooperating with well-points dewatering |
Yunjin Hu, Jiqing Jiang, Lianying Zhou, Lu Shi |
2024-09-03 |
|
| 9956656 |
Electronic cigarette atomizer oiling and labeling device |
Haisheng Zou, Zhicheng Li, Xuebin Yu, Weizhao Tang, Lin Yang +2 more |
2018-05-01 |
|
| 8536635 |
Semiconductor structure and fabrication method thereof |
Chien-An Yu, Yuan-Sung Chang, Chun-Hung Chien |
2013-09-17 |
|
| 7741719 |
Integrated circuit system with dummy region |
Dong Liu, Cing Ge Lim, Subbiah Chettiar Mahadevan |
2010-06-22 |
|
| 7446039 |
Integrated circuit system with dummy region |
Dong Liu, Cing Gie Lim, Subbiah Chettiar Mahadevan |
2008-11-04 |
$19,000 |
| 7156726 |
Polishing apparatus and method for forming an integrated circuit |
Lup San Leong, Charles Lin |
2007-01-02 |
|
| 7060573 |
Extended poly buffer STI scheme |
Victor Lim, Lap Chan, Wang Ling Goh |
2006-06-13 |
$118,000 |
| 6964598 |
Polishing apparatus and method for forming an integrated circuit |
Lup San Leong, Charles Lin |
2005-11-15 |
$309,000 |
| 6664190 |
Pre STI-CMP planarization scheme |
Cheng-Hou Loh, Paul Proctor |
2003-12-16 |
$206,000 |
| 6613648 |
Shallow trench isolation using TEOS cap and polysilicon pullback |
Seng-Keong Victor Lim, Kong Hean Lee, Wang Ling Goh |
2003-09-02 |
$245,000 |
| 6613649 |
Method for buffer STI scheme with a hard mask layer as an oxidation barrier |
Seng-Keong Victor Lim, Alex See, Wang Ling Goh |
2003-09-02 |
$245,000 |
| 6528886 |
Intermetal dielectric layer for integrated circuits |
Huang Liu, John Sudijono, Juan Boon Tan, Edwin Goh, Alan Cuthbertson +3 more |
2003-03-04 |
|
| 6451687 |
Intermetal dielectric layer for integrated circuits |
Huang Liu, John Sudijono, Juan Boon Tan, Edwin Goh, Alan Cuthbertson +3 more |
2002-09-17 |
|
| 6443809 |
Polishing apparatus and method for forming an integrated circuit |
Lup San Leong, Charles Lin |
2002-09-03 |
$667,000 |
| 6376376 |
Method to prevent CU dishing during damascene formation |
Victor Lim, Wang Ling Goh |
2002-04-23 |
$411,000 |
| 6376378 |
Polishing apparatus and method for forming an integrated circuit |
Lup San Leong, Charles Lin |
2002-04-23 |
$411,000 |
| 6306723 |
Method to form shallow trench isolations without a chemical mechanical polish |
Kok Hin Teo |
2001-10-23 |
$695,000 |
| 6284644 |
IMD scheme by post-plasma treatment of FSG and TEOS oxide capping layer |
Arthur Khoon Siah Aug, Qiong Li |
2001-09-04 |
$414,000 |
| 6281082 |
Method to form MOS transistors with a common shallow trench isolation and interlevel dielectric gap fill |
Kok Hin Teo, Kok Hiang Tang, Alex See |
2001-08-28 |
$1,200,000 |
| 6274485 |
Method to reduce dishing in metal chemical-mechanical polishing |
Rick Teo, Lap Chan |
2001-08-14 |
$1,252,000 |
| 6204137 |
Method to form transistors and local interconnects using a silicon nitride dummy gate technique |
Kok Hin Teo, Alex See, Lap Chan |
2001-03-20 |
$6,654,000 |
| 6103569 |
Method for planarizing local interconnects |
Kok Hin Teo, Lap Chan |
2000-08-15 |
$23,830,000 |