Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532569 | Method for manufacturing semiconductor package structure | Jui-Pin Hung, Feng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng | 2022-12-20 |
| 11069652 | Method of manufacturing semiconductor structure | Alexander Kalnitsky, Yi-Yang Lei, Hsi-Ching Wang, Cheng-Yu Kuo, Tsung Lung Huang +9 more | 2021-07-20 |
| 10636747 | Semiconductor package structure | Jui-Pin Hung, Feng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng | 2020-04-28 |
| 10535629 | Method of manufacturing semiconductor structure | Alexander Kalnitsky, Yi-Yang Lei, Hsi-Ching Wang, Cheng-Yu Kuo, Tsung Lung Huang +9 more | 2020-01-14 |
| 10163849 | Method of manufacturing semiconductor structure | Alexander Kalnitsky, Yi-Yang Lei, Hsi-Ching Wang, Cheng-Yu Kuo, Tsung Lung Huang +9 more | 2018-12-25 |
| 10115686 | Semiconductor structure and fabricating method thereof | Wei-Li Huang, Jheng-Jie Wong, Hsiang-Sheng Su, Tsung Lung Huang, Kuo-Chio Liu +3 more | 2018-10-30 |
| 9997471 | Semiconductor package structure and manufacturing method thereof | Jui-Pin Hung, Feng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng | 2018-06-12 |
| 9799625 | Semiconductor structure and manufacturing method thereof | Alexander Kalnitsky, Yi-Yang Lei, Hsi-Ching Wang, Cheng-Yu Kuo, Tsung Lung Huang +9 more | 2017-10-24 |
| 6191033 | Method of fabricating an integrated circuit with improved contact barrier | Yih-Shung Lin | 2001-02-20 |
| 5652464 | Integrated circuit with a titanium nitride contact barrier having oxygen stuffed grain boundaries | Yih-Shung Lin | 1997-07-29 |
| 5374592 | Method for forming an aluminum metal contact | Robert B. MacNaughton | 1994-12-20 |