Issued Patents All Time
Showing 1–25 of 110 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381180 | Multi-chip packages and methods of forming the same | Shuo-Mao Chen, Han-Hsiang Huang, Hsien-Wen Liu, Shin-Puu Jeng, Hsiao-Wen Lee | 2025-08-05 |
| 12362276 | Semiconductor package having a semiconductor device bonded to a circuit substrate through a floated or grounded dummy conductor and method of manufacturing the same | Shin-Puu Jeng | 2025-07-15 |
| 12322742 | Semiconductor structure and manufacturing method thereof | Hsiang-Tai Lu, Shuo-Mao Chen, Mill-Jer Wang, Chao-Hsiang Yang, Shin-Puu Jeng +4 more | 2025-06-03 |
| 12278156 | Semiconductor package | Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng, Wen-Yi Lin, Shu-Shen Yeh | 2025-04-15 |
| 12249550 | Semiconductor package and method manufacturing the same | Shin-Puu Jeng | 2025-03-11 |
| 12243800 | Package structure with lid and method for forming the same | Shin-Puu Jeng, Po-Yao Lin, Shuo-Mao Chen, Chin-Hua Wang | 2025-03-04 |
| 12218095 | Chip package structure having molding layer | Shin-Puu Jeng, Shuo-Mao Chen | 2025-02-04 |
| 12176258 | Semiconductor package and method manufacturing the same | Shin-Puu Jeng | 2024-12-24 |
| 12154888 | Semiconductor package and method of manufacturing the same | Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin, Shuo-Mao Chen, Shin-Puu Jeng | 2024-11-26 |
| 12125833 | Integrated circuit package and method forming same | Shin-Puu Jeng, Shuo-Mao Chen | 2024-10-22 |
| 12125755 | Chip package structure with cavity in interposer | Shin-Puu Jeng, Shuo-Mao Chen | 2024-10-22 |
| 12113025 | Semiconductor package with dual sides of metal routing | Shin-Puu Jeng, Shuo-Mao Chen, Hsien-Wen Liu, Po-Yao Chuang, Po-Yao Lin | 2024-10-08 |
| 12094810 | Reinforcing package using reinforcing patches | Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin, Shuo-Mao Chen, Shin-Puu Jeng | 2024-09-17 |
| 12046548 | Chip package with redistribution structure having multiple chips | Shin-Puu Jeng, Po-Hao Tsai, Po-Yao Chuang, Shuo-Mao Chen, Techi Wong | 2024-07-23 |
| 11948914 | Chip package structure with integrated device integrated beneath the semiconductor chip | Shin-Puu Jeng, Shuo-Mao Chen | 2024-04-02 |
| 11942408 | Semiconductor structure and manufacturing method thereof | Shuo-Mao Chen, Shin-Puu Jeng | 2024-03-26 |
| 11915992 | Method for forming package structure with lid | Shin-Puu Jeng, Po-Yao Lin, Shuo-Mao Chen, Chin-Hua Wang | 2024-02-27 |
| 11887952 | Semiconductor device encapsulated by molding material attached to redistribution layer | Shin-Puu Jeng, Shuo-Mao Chen | 2024-01-30 |
| 11862528 | Method for forming semiconductor package | Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng, Wen-Yi Lin, Shu-Shen Yeh | 2024-01-02 |
| 11862469 | Package structure and method of manufacturing the same | Shuo-Mao Chen, Shin-Puu Jeng | 2024-01-02 |
| 11855066 | Semiconductor structure and manufacturing method thereof | Hsiang-Tai Lu, Shuo-Mao Chen, Mill-Jer Wang, Chao-Hsiang Yang, Shin-Puu Jeng +4 more | 2023-12-26 |
| 11810830 | Chip package structure with cavity in interposer | Shin-Puu Jeng, Shuo-Mao Chen | 2023-11-07 |
| 11791301 | Chip package structure | Shin-Puu Jeng, Shuo-Mao Chen | 2023-10-17 |
| 11756928 | Multi-chip packages | Shuo-Mao Chen, Han-Hsiang Huang, Hsien-Wen Liu, Shin-Puu Jeng, Hsiao-Wen Lee | 2023-09-12 |
| 11756892 | Method for forming chip package structure | Shin-Puu Jeng, Shuo-Mao Chen, Po-Yao Lin | 2023-09-12 |