Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12322742 | Semiconductor structure and manufacturing method thereof | Hsiang-Tai Lu, Shuo-Mao Chen, Mill-Jer Wang, Feng-Cheng Hsu, Shin-Puu Jeng +4 more | 2025-06-03 |
| 11869819 | Integrated circuit component and package structure having the same | Tzuan-Horng Liu, Hsien-Wei Chen, Ming-Fa Chen | 2024-01-09 |
| 11855066 | Semiconductor structure and manufacturing method thereof | Hsiang-Tai Lu, Shuo-Mao Chen, Mill-Jer Wang, Feng-Cheng Hsu, Shin-Puu Jeng +4 more | 2023-12-26 |
| D996501 | Camera | Kun Zhu, Stefanie Gügel-Wild, Jun Xiong | 2023-08-22 |
| 11450579 | Integrated circuit component and package structure having the same | Tzuan-Horng Liu, Hsien-Wei Chen, Ming-Fa Chen | 2022-09-20 |
| 11335672 | Semiconductor structure and manufacturing method thereof | Hsiang-Tai Lu, Shuo-Mao Chen, Mill-Jer Wang, Feng-Cheng Hsu, Shin-Puu Jeng +4 more | 2022-05-17 |
| 11169207 | Testing of semiconductor chips with microbumps | Wei-Cheng Wu, Hsien-Pin Hu, Shang-Yun Hou, Shin-Puu Jeng, Chen-Hua Yu | 2021-11-09 |
| 10957610 | Integrated circuit component and package structure having the same | Tzuan-Horng Liu, Hsien-Wei Chen, Ming-Fa Chen | 2021-03-23 |
| 10741537 | Semiconductor structure and manufacturing method thereof | Hsiang-Tai Lu, Shuo-Mao Chen, Mill-Jer Wang, Feng-Cheng Hsu, Shin-Puu Jeng +4 more | 2020-08-11 |
| 10663512 | Testing of semiconductor chips with microbumps | Wei-Cheng Wu, Hsien-Pin Hu, Shang-Yun Hou, Shin-Puu Jeng, Chen-Hua Yu | 2020-05-26 |
| 10483174 | Integrated circuit component and package structure having the same | Tzuan-Horng Liu, Hsien-Wei Chen, Ming-Fa Chen | 2019-11-19 |
| 10175294 | Testing of semiconductor chips with microbumps | Wei-Cheng Wu, Hsien-Pin Hu, Shang-Yun Hou, Shin-Puu Jeng, Chen-Hua Yu | 2019-01-08 |
| 9618572 | Testing of semiconductor chips with microbumps | Wei-Cheng Wu, Hsien-Pin Hu, Shang-Yun Hou, Shin-Puu Jeng, Chen-Hua Yu | 2017-04-11 |
| 9372206 | Testing of semiconductor chips with microbumps | Wei-Cheng Wu, Hsien-Pin Hu, Shang-Yun Hou, Shin-Puu Jeng, Chen-Hua Yu | 2016-06-21 |
| 9116203 | Testing of semiconductor chips with microbumps | Wei-Cheng Wu, Hsien-Pin Hu, Shang-Yun Hou, Shin-Puu Jeng, Chen-Hua Yu | 2015-08-25 |
| 9097860 | Lens assembly | Hung-Kuo Yu | 2015-08-04 |
| 9001437 | Imaging lens assembly | Kuo-Yu Liao, Chen-Hung Tsai, Po-Jui Liao | 2015-04-07 |
| 8797057 | Testing of semiconductor chips with microbumps | Wei-Cheng Wu, Hsien-Pin Hu, Shang-Yun Hou, Shin-Puu Jeng, Chen-Hua Yu | 2014-08-05 |
| 8576502 | Miniaturized lens assembly | Chun-Hong Chen | 2013-11-05 |
| 8049323 | Chip holder with wafer level redistribution layer | Chen-Shien Chen, Jimmy Liang, Han-Liang Tseng, Mirng-Ji Lii, Tjandra Winata Karta +1 more | 2011-11-01 |
| 7456507 | Die seal structure for reducing stress induced during die saw process | — | 2008-11-25 |
| 7397106 | Laser fuse with efficient heat dissipation | Hao-Yi Tsai, Shang-Yun Hou, Chia-Lun Tsai, Shin-Puu Jeng | 2008-07-08 |
| 7009222 | Protective metal structure and method to protect low-K dielectric layer during fuse blow process | — | 2006-03-07 |
| 6867441 | Metal fuse structure for saving layout area | Charles Chen, Wesley Lin, Harry Chuang, Ming Li, Jeng-Long Huang | 2005-03-15 |
| 6835642 | Method of forming a metal fuse on semiconductor devices | Chun-Ming Su | 2004-12-28 |