Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8704383 | Silicon-based thin substrate and packaging schemes | Szu-Wei Lu, Clinton Chao, Ann Luh, Jerry Tzou, Kuo-Chin Chang | 2014-04-22 |
| 8551813 | Wafer level IC assembly method | Chien-Hsiun Lee, Clinton Chao, Mirng-Ji Lii | 2013-10-08 |
| 8334170 | Method for stacking devices | Dean Wang, Chien-Hsiun Lee, Chen-Shien Chen, Clinton Chao, Mirng-Ji Lii | 2012-12-18 |
| 8247267 | Wafer level IC assembly method | Chien-Hsiun Lee, Clinton Chao, Mirng-Ji Lii | 2012-08-21 |
| 8232183 | Process and apparatus for wafer-level flip-chip assembly | Chien-Hsiun Lee, Ming-Chung Sung, Clinton Chao | 2012-07-31 |
| 8174129 | Silicon-based thin substrate and packaging schemes | Szu-Wei Lu, Clinton Chao, Ann Luh, Jerry Tzou, Kuo-Chin Chang | 2012-05-08 |
| 8049323 | Chip holder with wafer level redistribution layer | Chen-Shien Chen, Chao-Hsiang Yang, Jimmy Liang, Han-Liang Tseng, Mirng-Ji Lii +1 more | 2011-11-01 |
| 7977155 | Wafer-level flip-chip assembly methods | Chien-Hsiun Lee, Clinton Chao, Ming-Chung Sung | 2011-07-12 |
| 7863742 | Back end integrated WLCSP structure without aluminum pads | Hsiu-Mei Yu, Daniel Yang, Shih-Ming Chen, Chia-Jen Cheng | 2011-01-04 |
| 7846769 | Stratified underfill method for an IC package | Mirng-Ji Lii, Szu-Wei Lu, Chien-Hsiun Lee | 2010-12-07 |
| 7842548 | Fixture for P-through silicon via assembly | Chien-Hsiun Lee, Chen-Shien Chen, Mirng-Ji Lii | 2010-11-30 |
| 7838424 | Enhanced reliability of wafer-level chip-scale packaging (WLCSP) die separation using dry etching | Steven Hsu, Chien-Hsiun Lee, Gene Wu, Jimmy Liang | 2010-11-23 |
| 7804177 | Silicon-based thin substrate and packaging schemes | Szu-Wei Lu, Clinton Chao, Ann Luh, Jerry Tzou, Kuo-Chin Chang | 2010-09-28 |
| 7656042 | Stratified underfill in an IC package | Mirng-Ji Lii, Szu-Wei Lu, Chien-Hsiun Lee | 2010-02-02 |
| 7514775 | Stacked structures and methods of fabricating stacked structures | Clinton Chao, Tsorng-Dih Yuan, Hsin-Yu Pan, Kim Chen, Mark Shane Peng | 2009-04-07 |
| 7427803 | Electromagnetic shielding using through-silicon vias | Clinton Chao, Chao-Shun Hsu, Mark Shane Peng, Szu-Wei Lu | 2008-09-23 |
| 5331200 | Lead-on-chip inner lead bonding lead frame method and apparatus | Boon C. Teo, Siu Waf Low | 1994-07-19 |