Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8945998 | Programmable semiconductor interposer for electronic package and method of forming | Clinton Chao, Mark Shane Peng | 2015-02-03 |
| 8704375 | Barrier structures and methods for through substrate vias | Max Liu, Ya-Wen Tseng, Wen-Chih Chiou, Weng-Jin Wu | 2014-04-22 |
| 8492872 | On-chip inductors with through-silicon-via fence for Q improvement | Li Yang, Ming-Ta Yang | 2013-07-23 |
| 8476735 | Programmable semiconductor interposer for electronic package and method of forming | Clinton Chao, Mark Shane Peng | 2013-07-02 |
| 7812426 | TSV-enabled twisted pair | Mark Shane Peng, Clinton Chao | 2010-10-12 |
| 7795735 | Methods for forming single dies with multi-layer interconnect structures and structures formed therefrom | Chen-Yao Tang, Clinton Chao, Mark Shane Peng | 2010-09-14 |
| 7565635 | SiP (system in package) design systems and methods | Clinton Chao, Louis Chaochiuan Liu, Lewis Chu, Mark Shane Peng, Kim Chen | 2009-07-21 |
| 7494846 | Design techniques for stacking identical memory dies | Louis Liu, Clinton Chao, Mark Shane Peng | 2009-02-24 |
| 7427803 | Electromagnetic shielding using through-silicon vias | Clinton Chao, Mark Shane Peng, Szu-Wei Lu, Tjandra Winata Karta | 2008-09-23 |