Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183729 | Integrated circuit filler and method thereof | Tseng Chin Lo, Molly Chang, Chih-Ting Sun, Zi-Kuan Li, Bo-Sen Chang +1 more | 2024-12-31 |
| 11776948 | Integrated circuit filler and method thereof | Tseng Chin Lo, Molly Chang, Chih-Ting Sun, Zi-Kuan Li, Bo-Sen Chang +1 more | 2023-10-03 |
| 11309307 | Integrated circuit filler and method thereof | Tseng Chin Lo, Molly Chang, Chih-Ting Sun, Zi-Kuan Li, Bo-Sen Chang +1 more | 2022-04-19 |
| 10679980 | Integrated circuit filler and method thereof | Tseng Chin Lo, Molly Chang, Chih-Ting Sun, Zi-Kuan Li, Bo-Sen Chang +1 more | 2020-06-09 |
| 10388645 | Integrated circuit filler and method thereof | Tseng Chin Lo, Molly Chang, Chih-Ting Sun, Zi-Kuan Li, Bo-Sen Chang +1 more | 2019-08-20 |
| 10283496 | Integrated circuit filler and method thereof | Tseng Chin Lo, Molly Chang, Chih-Ting Sun, Zi-Kuan Li, Bo-Sen Chang +1 more | 2019-05-07 |
| 8704375 | Barrier structures and methods for through substrate vias | Max Liu, Chao-Shun Hsu, Wen-Chih Chiou, Weng-Jin Wu | 2014-04-22 |