Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183729 | Integrated circuit filler and method thereof | Tseng Chin Lo, Ya-Wen Tseng, Chih-Ting Sun, Zi-Kuan Li, Bo-Sen Chang +1 more | 2024-12-31 |
| 11776948 | Integrated circuit filler and method thereof | Tseng Chin Lo, Ya-Wen Tseng, Chih-Ting Sun, Zi-Kuan Li, Bo-Sen Chang +1 more | 2023-10-03 |
| 11309307 | Integrated circuit filler and method thereof | Tseng Chin Lo, Ya-Wen Tseng, Chih-Ting Sun, Zi-Kuan Li, Bo-Sen Chang +1 more | 2022-04-19 |
| 10976983 | Smart collaboration across multiple locations | Der-Joung Wang, David Shao Chung Chen, Lilian Lai, Louis Huang, Wei-Te Chiang +2 more | 2021-04-13 |
| 10679980 | Integrated circuit filler and method thereof | Tseng Chin Lo, Ya-Wen Tseng, Chih-Ting Sun, Zi-Kuan Li, Bo-Sen Chang +1 more | 2020-06-09 |
| 10388645 | Integrated circuit filler and method thereof | Tseng Chin Lo, Ya-Wen Tseng, Chih-Ting Sun, Zi-Kuan Li, Bo-Sen Chang +1 more | 2019-08-20 |
| 10282174 | Software layout processing localization | Xiao Feng Ji, Michael R. O'Brien | 2019-05-07 |
| 10283496 | Integrated circuit filler and method thereof | Tseng Chin Lo, Ya-Wen Tseng, Chih-Ting Sun, Zi-Kuan Li, Bo-Sen Chang +1 more | 2019-05-07 |