Issued Patents All Time
Showing 1–25 of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11996424 | Controllable gap height for an image sensor package | — | 2024-05-28 |
| 11605659 | Packaging structure for a sensor having a sealing layer | — | 2023-03-14 |
| 11508776 | Image sensor semiconductor packages and related methods | Larry D. Kinsman, Yusheng LIN, Yu-Te HSIEH, Oswald Skeete, Chi-Yao Kuo | 2022-11-22 |
| 11508766 | Molded image sensor chip scale packages and related methods | — | 2022-11-22 |
| 11289522 | Controllable gap height for an image sensor package | — | 2022-03-29 |
| 11201182 | Embedded image sensor semiconductor packages and related methods | — | 2021-12-14 |
| 11004832 | System, structure, and method of manufacturing a semiconductor substrate stack | Hung-Pin Chang, Wen-Chih Chiou, Chen-Hua Yu | 2021-05-11 |
| 10910421 | Molded image sensor chip scale packages and related methods | — | 2021-02-02 |
| 10903255 | Image sensor flip chip package | — | 2021-01-26 |
| 10868061 | Packaging structure for a sensor having a sealing layer | — | 2020-12-15 |
| 10707250 | Embedded image sensor semiconductor packages and related methods | — | 2020-07-07 |
| 10615202 | Embedded image sensor semiconductor packages and related methods | — | 2020-04-07 |
| 10515933 | System, structure, and method of manufacturing a semiconductor substrate stack | Hung-Pin Chang, Wen-Chih Chiou, Chen-Hua Yu | 2019-12-24 |
| 10418396 | Stacked image sensor package | — | 2019-09-17 |
| 10290672 | Image sensor semiconductor packages and related methods | Larry D. Kinsman, Yusheng LIN, Yu-Te HSIEH, Oswald Skeete, Chi-Yao Kuo | 2019-05-14 |
| 10128289 | Embedded image sensor semiconductor packages and related methods | — | 2018-11-13 |
| 9997440 | Protection layer for adhesive material at wafer edge | Wen-Chih Chiou, Shau-Lin Shue | 2018-06-12 |
| 9978628 | Bonding method including adjusting surface contours of a bonding system | Yu-Liang Lin, Jing-Cheng Lin | 2018-05-22 |
| 9960197 | Molded image sensor chip scale packages and related methods | — | 2018-05-01 |
| 9799694 | Backside through vias in a bonded structure | Ku-Feng Yang, Hung-Pin Chang, Wen-Chih Chiou, Chen-Hua Yu | 2017-10-24 |
| 9793192 | Formation of through via before contact processing | Chen-Hua Yu, Wen-Chih Chiou | 2017-10-17 |
| 9728457 | System, structure, and method of manufacturing a semiconductor substrate stack | Hung-Pin Chang, Wen-Chih Chiou, Chen-Hua Yu | 2017-08-08 |
| 9515108 | Image sensors with contamination barrier structures | Yu-Te HSIEH | 2016-12-06 |
| 9478480 | Alignment mark and method of formation | Chen-Yu Tsai, Shih-Hui Wang, Chien-Ming Chiu, Chia-Ho Chen, Fang Wen Tsai +4 more | 2016-10-25 |
| 9418876 | Method of three dimensional integrated circuit assembly | Jing-Cheng Lin, Shih-Ting Lin, Cheng-Lin Huang, Szu-Wei Lu, Shin-Puu Jeng +1 more | 2016-08-16 |