Issued Patents All Time
Showing 26–50 of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9418961 | Apparatus and method of substrate to substrate bonding for three dimensional (3D) IC interconnects | Chen-Hua Yu, Wen-Chih Chiou | 2016-08-16 |
| 9299612 | Stacked structures and methods of forming stacked structures | Wen-Chih Chiou, Chen-Hua Yu | 2016-03-29 |
| 9299594 | Substrate bonding system and method of modifying the same | Yu-Liang Lin, Jing-Cheng Lin | 2016-03-29 |
| 9293418 | Backside through vias in a bonded structure | Ku-Feng Yang, Hung-Pin Chang, Wen-Chih Chiou, Chen-Hua Yu | 2016-03-22 |
| 9287166 | Barrier for through-silicon via | Chen-Hua Yu, Wen-Chih Chiou | 2016-03-15 |
| 9209157 | Formation of through via before contact processing | Wen-Chih Chiou, Chen-Hua Yu | 2015-12-08 |
| 9153462 | Spin chuck for thin wafer cleaning | Yu-Liang Lin, Jing-Cheng Lin, Wen-Chih Chiou | 2015-10-06 |
| 9117828 | Method of handling a thin wafer | Ku-Feng Yang, Wen-Chih Chiou | 2015-08-25 |
| 9093447 | Chip on wafer bonder | Chen-Hua Yu, Jui-Pin Hung, Jean Wang, Wen-Chih Chiou | 2015-07-28 |
| 8896136 | Alignment mark and method of formation | Chen-Yu Tsai, Shih-Hui Wang, Chien-Ming Chiu, Chia-Ho Chen, Fang Wen Tsai +4 more | 2014-11-25 |
| 8853830 | System, structure, and method of manufacturing a semiconductor substrate stack | Hung-Pin Chang, Wen-Chih Chiou, Chen-Hua Yu | 2014-10-07 |
| 8846523 | Process of forming through-silicon via structure | Yung-Chi Lin, Wen-Chih Chiou | 2014-09-30 |
| 8846499 | Composite carrier structure | Ying-Ching Shih, Jing-Cheng Lin, Wen-Chih Chiou, Shin-Puu Jeng, Chen-Hua Yu | 2014-09-30 |
| 8791011 | Through-silicon via structure formation process | Yung-Chi Lin, Shau-Lin Shue | 2014-07-29 |
| 8736039 | Stacked structures and methods of forming stacked structures | Wen-Chih Chiou, Chen-Hua Yu | 2014-05-27 |
| 8722540 | Controlling defects in thin wafer handling | Yu-Liang Lin, Jing-Cheng Lin | 2014-05-13 |
| 8704375 | Barrier structures and methods for through substrate vias | Max Liu, Chao-Shun Hsu, Ya-Wen Tseng, Wen-Chih Chiou | 2014-04-22 |
| 8691664 | Backside process for a substrate | Ku-Feng Yang, Wen-Chih Chiou, Jung-Chih Hu | 2014-04-08 |
| 8680682 | Barrier for through-silicon via | Chen-Hua Yu, Wen-Chih Chiou | 2014-03-25 |
| 8669174 | Multi-die stacking using bumps with different sizes | Ying-Ching Shih, Wen-Chih Chiou, Shin-Puu Jeng, Chen-Hua Yu | 2014-03-11 |
| 8664749 | Component stacking using pre-formed adhesive films | Hung-Jung Tu, Ku-Feng Yang, Jung-Chih Hu, Wen-Chih Chiou | 2014-03-04 |
| 8647925 | Surface modification for handling wafer thinning process | Wen-Chih Chiou, Shau-Lin Shue, Ju-Pin Hung | 2014-02-11 |
| 8629042 | Method for stacking semiconductor dies | Ku-Feng Yang, Wen-Chih Chiou, Chen-Hua Yu | 2014-01-14 |
| 8629565 | Thin wafer protection device | Ku-Feng Yang, Wen-Chih Chiou, Tsung-Ding Wang | 2014-01-14 |
| 8581418 | Multi-die stacking using bumps with different sizes | Ying-Ching Shih, Wen-Chih Chiou, Shin-Puu Jeng, Chen-Hua Yu | 2013-11-12 |