Issued Patents All Time
Showing 76–85 of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7951723 | Integrated etch and supercritical CO2 process and chamber design | Ching-Ya Wang, Henry Lo, Jean Wang | 2011-05-31 |
| 7943421 | Component stacking using pre-formed adhesive films | Hung-Jung Tu, Ku-Feng Yang, Jung-Chih Hu, Wen-Chih Chiou | 2011-05-17 |
| 7939941 | Formation of through via before contact processing | Wen-Chih Chiou, Chen-Hua Yu | 2011-05-10 |
| 7897481 | High throughput die-to-wafer bonding using pre-alignment | Wen-Chih Chiou, Chen-Hua Yu | 2011-03-01 |
| 7879711 | Stacked structures and methods of fabricating stacked structures | Chen-Hua Yu, Wen-Chih Chiou, Jean Wang | 2011-02-01 |
| 7872357 | Protection for bonding pads and methods of formation | Chen-Hua Yu, Wen-Chih Chiou | 2011-01-18 |
| 7812459 | Three-dimensional integrated circuits with protection layers | Chen-Hua Yu, Wen-Chih Chiou, Hung-Jung Tu, Ku-Feng Yang | 2010-10-12 |
| 7466028 | Semiconductor contact structure | Chen-Hua Yu, Wen-Chih Chiou, Hung-Jung Tu | 2008-12-16 |
| 7385283 | Three dimensional integrated circuit and method of making the same | Wen-Chih Chiou | 2008-06-10 |
| 6511235 | Integrated surface-emitting optoelectronic module and the method for making the same | Yih-Der Guo, Tsung-Hsuan Chiu, Rong-Heng Yuang, Mu-Tao Chu | 2003-01-28 |