Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8691664 | Backside process for a substrate | Ku-Feng Yang, Weng-Jin Wu, Wen-Chih Chiou | 2014-04-08 |
| 8664749 | Component stacking using pre-formed adhesive films | Weng-Jin Wu, Hung-Jung Tu, Ku-Feng Yang, Wen-Chih Chiou | 2014-03-04 |
| 8486823 | Methods of forming through via | Wen-Chih Chiou, Chen-Hua Yu, Weng-Jin Wu | 2013-07-16 |
| 8058150 | Particle free wafer separation | Weng-Jin Wu, Ku-Feng Yang, Wen-Chih Chiou, Chen-Hua Yu | 2011-11-15 |
| 7943421 | Component stacking using pre-formed adhesive films | Weng-Jin Wu, Hung-Jung Tu, Ku-Feng Yang, Wen-Chih Chiou | 2011-05-17 |
| 6858123 | Galvanizing solution for the galvanic deposition of copper | Wu-Chun Gau, Ting-Chang Chang, Ming Feng, Chun-Lin Cheng, You-Shin Lin +2 more | 2005-02-22 |
| 6417118 | Method for improving the moisture absorption of porous low dielectric film | Lih-Juann Chen | 2002-07-09 |
| 6171717 | Structure of stacked barrier layer | Ting-Chang Chang | 2001-01-09 |