Issued Patents All Time
Showing 1–25 of 90 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12387996 | Through-substrate vias with improved connections | Jing-Cheng Lin | 2025-08-12 |
| 12366004 | Apparatus and method for wafer pre-wetting | Chen-Yu Tsai, Wen-Chih Chiou | 2025-07-22 |
| 12362315 | Heterogeneous dielectric bonding scheme | Chen-Hua Yu, Wen-Chih Chiou, Ming-Tsu Chung | 2025-07-15 |
| 12322680 | Semiconductor device having backside interconnect structure on through substrate via | Yung-Chi Lin, Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Hong-Ye Shih +3 more | 2025-06-03 |
| 12278203 | Semiconductor structure and manufacturing method thereof | Chen-Yu Tsai, Tsang-Jiuh Wu, Wen-Chih Chiou | 2025-04-15 |
| 12237284 | Semiconductor structure comprising dummy feature interposed between the bonding connectors | Chen-Yu Tsai, Tsang-Jiuh Wu, Wen-Chih Chiou | 2025-02-25 |
| 12227867 | Plating apparatus for plating semiconductor wafer and plating method | Chen-Yu Tsai, Wen-Chih Chiou | 2025-02-18 |
| 12132016 | Bonding structures of integrated circuit devices and method forming the same | Chen-Yu Tsai, Wen-Chih Chiou | 2024-10-29 |
| 12131954 | Selective epitaxy process for the formation of CFET local interconnection | Che Chi Shih, Hsin Yang Hung, Wei-Yen Woon, Szuya S. Liao | 2024-10-29 |
| 12132079 | Bonding and isolation techniques for stacked transistor structures | Kuan-Kan Hu, Han-De Chen, Chen-Fong Tsai, Chi On Chui, Szuya S. Liao | 2024-10-29 |
| 12087732 | Isolation bonding film for semiconductor packages and methods of forming the same | Ming-Tsu Chung, Yung-Chi Lin, Wen-Chih Chiou, Chen-Hua Yu | 2024-09-10 |
| 12074064 | TSV structure and method forming same | Ming-Tsu Chung, Tsang-Jiuh Wu, Wen-Chih Chiou, Chen-Hua Yu | 2024-08-27 |
| 11990430 | Bonding structures of integrated circuit devices and method forming the same | Chen-Yu Tsai, Wen-Chih Chiou | 2024-05-21 |
| 11869869 | Heterogeneous dielectric bonding scheme | Chen-Hua Yu, Wen-Chih Chiou, Ming-Tsu Chung | 2024-01-09 |
| 11823979 | Method of forming semiconductor device having backside interconnect structure on through substrate via | Yung-Chi Lin, Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Hong-Ye Shih +3 more | 2023-11-21 |
| 11728296 | Interconnect structure and method of forming same | Hsiao Yun Lo, Lin-Chih Huang, Tasi-Jung Wu, Hsin-Yu Chen, Yung-Chi Lin +2 more | 2023-08-15 |
| 11721666 | Isolation bonding film for semiconductor packages and methods of forming the same | Ming-Tsu Chung, Yung-Chi Lin, Wen-Chih Chiou, Chen-Hua Yu | 2023-08-08 |
| 11688639 | Semiconductor device and method | Chen-Hua Yu, Hung-Pin Chang, Yi-Hsiu Chen, Wen-Chih Chiou | 2023-06-27 |
| 11585008 | Plating apparatus for plating semiconductor wafer and plating method | Chen-Yu Tsai, Wen-Chih Chiou | 2023-02-21 |
| 11585005 | Apparatus and method for wafer pre-wetting | Chen-Yu Tsai, Wen-Chih Chiou | 2023-02-21 |
| 11527439 | TSV structure and method forming same | Ming-Tsu Chung, Tsang-Jiuh Wu, Wen-Chih Chiou, Chen-Hua Yu | 2022-12-13 |
| 11296011 | Through-substrate vias with improved connections | Jing-Cheng Lin | 2022-04-05 |
| 11101240 | Isolation bonding film for semiconductor packages and methods of forming the same | Ming-Tsu Chung, Yung-Chi Lin, Wen-Chih Chiou, Chen-Hua Yu | 2021-08-24 |
| 11056419 | Semiconductor device having backside interconnect structure on through substrate via and method of forming the same | Yung-Chi Lin, Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Hong-Ye Shih +3 more | 2021-07-06 |
| 11004741 | Profile of through via protrusion in 3DIC interconnect | Jiung Wu, Kuan-Liang Lai, Ming-Tsu Chung, Hong-Ye Shih, Tsang-Jiuh Wu +3 more | 2021-05-11 |