Issued Patents All Time
Showing 1–25 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417924 | Formation of self-assembled monolayer for selective etching process | Kenichi Sano | 2025-09-16 |
| 12272733 | Transistor device for source/drain backside contact and method of forming cavity | Andrew Joseph Kelly | 2025-04-08 |
| 12218022 | Passivation structure with planar top surfaces | Wen-Chih Chiou, Chen-Hua Yu | 2025-02-04 |
| 12063796 | Manufacturing method of resistive random access memory device | Chia-Wen Cheng, Ping Wang, He-Hsuan Chao | 2024-08-13 |
| 12051672 | Package structure and method of forming the same | Ebin Liao, Hong-Ye Shih, Wen-Chih Chiou, Jia-Ling Ko | 2024-07-30 |
| 12015413 | Coding for pulse amplitude modulation with an odd number of output levels | Charles L. Wang, Pranavi Sunkara | 2024-06-18 |
| 12007435 | Method of copper hillock detecting | Ching-Chih Chang, Yuan-Fu Ko, Chih-Sheng Chang | 2024-06-11 |
| 11942527 | Forming a cavity with a wet etch for backside contact formation | Andrew Joseph Kelly | 2024-03-26 |
| 11817361 | Passivation structure with planar top surfaces | Wen-Chih Chiou, Chen-Hua Yu | 2023-11-14 |
| 11699694 | Method of manufacturing semiconductor package structure | Chen-Hua Yu, Ming-Fa Chen, Wen-Chih Chiou | 2023-07-11 |
| 11688639 | Semiconductor device and method | Chen-Hua Yu, Hung-Pin Chang, Ku-Feng Yang, Wen-Chih Chiou | 2023-06-27 |
| 11502131 | Resistive random access memory device and manufacturing method thereof | Chia-Wen Cheng, Ping Wang, He-Hsuan Chao | 2022-11-15 |
| 11437480 | Forming a cavity with a wet etch for backside contact formation | Andrew Joseph Kelly | 2022-09-06 |
| 11043481 | Method of manufacturing semiconductor package structure | Chen-Hua Yu, Ming-Fa Chen, Wen-Chih Chiou | 2021-06-22 |
| 10950789 | Resisitive random access memory structure and method for forming the same | Bo-Lun Wu, Ting-Ying Shen, Po-Yen Hsu | 2021-03-16 |
| 10879214 | Die stack structure and method of fabricating the same | Wen-Chih Chiou, Yung-Lung Chen | 2020-12-29 |
| 10867943 | Die structure, die stack structure and method of fabricating the same | Tsang-Jiuh Wu, Wen-Chih Chiou, Tung-Hsien Wu | 2020-12-15 |
| 10672737 | Three-dimensional integrated circuit structure and method of manufacturing the same | Ebin Liao, Hong-Ye Shih, Wen-Chih Chiou, Jia-Ling Ko | 2020-06-02 |
| 10665582 | Method of manufacturing semiconductor package structure | Chen-Hua Yu, Ming-Fa Chen, Wen-Chih Chiou | 2020-05-26 |
| 10636842 | Resistive random access memory and method for forming the same | Chia-Wen Cheng, Po-Yen Hsu, Ping Wang, Ming-Che Lin, He-Hsuan Chao | 2020-04-28 |
| 10600732 | Semiconductor device and method for fabricating the same | Min-Shiang Hsu, Yu-Han Tsai, Chih-Sheng Chang | 2020-03-24 |
| 10593877 | Resistive random access memory | Frederick Chen, Ping Wang, Shao-Ching Liao, Po-Yen Hsu, Ting-Ying Shen +4 more | 2020-03-17 |
| 10510699 | Bond structures and the methods of forming the same | Chen-Hua Yu, Wen-Chih Chiou, Ming-Fa Chen | 2019-12-17 |
| 10510604 | Semiconductor device and method | Chen-Hua Yu, Hung-Pin Chang, Ku-Feng Yang, Wen-Chih Chiou | 2019-12-17 |
| 10311622 | Virtual reality device and method for virtual reality | — | 2019-06-04 |