Issued Patents All Time
Showing 1–25 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142485 | Semiconductor structure and manufacturing method thereof | Tsang-Jiuh Wu, Wen-Chih Chiou | 2024-11-12 |
| 11688639 | Semiconductor device and method | Chen-Hua Yu, Yi-Hsiu Chen, Ku-Feng Yang, Wen-Chih Chiou | 2023-06-27 |
| 11594420 | Semiconductor structure and manufacturing method thereof | Tsang-Jiuh Wu, Wen-Chih Chiou | 2023-02-28 |
| 11004832 | System, structure, and method of manufacturing a semiconductor substrate stack | Weng-Jin Wu, Wen-Chih Chiou, Chen-Hua Yu | 2021-05-11 |
| 10978346 | Conductive vias in semiconductor packages and methods of forming same | Sung-Hui Huang, Sao-Ling Chiu, Shang-Yun Hou, Wan-Yu Lee | 2021-04-13 |
| 10515933 | System, structure, and method of manufacturing a semiconductor substrate stack | Weng-Jin Wu, Wen-Chih Chiou, Chen-Hua Yu | 2019-12-24 |
| 10510604 | Semiconductor device and method | Chen-Hua Yu, Yi-Hsiu Chen, Ku-Feng Yang, Wen-Chih Chiou | 2019-12-17 |
| 10510603 | Conductive vias in semiconductor packages and methods of forming same | Sung-Hui Huang, Sao-Ling Chiu, Shang-Yun Hou, Wan-Yu Lee | 2019-12-17 |
| 10497619 | Method of manufacturing a semiconductor device including through silicon plugs | Chen-Hua Yu, Chia-Lin Yu, Chien Ling Hwang, Jui-Pin Hung, Yung-Chi Lin | 2019-12-03 |
| 10269761 | Semiconductor device and method | Cheng-Chun Tsai, Ku-Feng Yang, Yi-Hsiu Chen, Wen-Chih Chiou | 2019-04-23 |
| 10163756 | Isolation structure for stacked dies | Kuo-Ching Hsu, Chen-Shien Chen, Wen-Chih Chiou, Chen-Hua Yu | 2018-12-25 |
| 10163709 | Semiconductor device and method | Chen-Hua Yu, Yi-Hsiu Chen, Ku-Feng Yang, Wen-Chih Chiou | 2018-12-25 |
| 10049931 | Method of manufacturing a semiconductor device including through silicon plugs | Chen-Hua Yu, Yung-Chi Lin, Chia-Lin Yu, Jui-Pin Hung, Chien Ling Hwang | 2018-08-14 |
| 9978607 | Through via structure and method | Yung-Chi Lin, Tsang-Jiuh Wu, Wen-Chih Chiou | 2018-05-22 |
| 9799694 | Backside through vias in a bonded structure | Weng-Jin Wu, Ku-Feng Yang, Wen-Chih Chiou, Chen-Hua Yu | 2017-10-24 |
| 9728457 | System, structure, and method of manufacturing a semiconductor substrate stack | Weng-Jin Wu, Wen-Chih Chiou, Chen-Hua Yu | 2017-08-08 |
| 9601410 | Semiconductor device and method | Cheng-Chun Tsai, Ku-Feng Yang, Yi-Hsiu Chen, Wen-Chih Chiou | 2017-03-21 |
| 9312225 | Bump structure for stacked dies | Kuo-Ching Hsu, Chen-Shien Chen, Wen-Chih Chiou, Chen-Hua Yu | 2016-04-12 |
| 9293418 | Backside through vias in a bonded structure | Weng-Jin Wu, Ku-Feng Yang, Wen-Chih Chiou, Chen-Hua Yu | 2016-03-22 |
| 9287440 | Method of manufacturing a semiconductor device including through silicon plugs | Chen-Hua Yu, Yung-Chi Lin, Chia-Lin Yu, Jui-Pin Hung, Chien Ling Hwang | 2016-03-15 |
| 8946742 | Semiconductor package with through silicon vias | Chen-Hua Yu, Yung-Chi Lin, Chia-Lin Yu, Jui-Pin Hung, Chien Ling Hwang | 2015-02-03 |
| 8896127 | Via structure and via etching process of forming the same | Wen-Chih Chiou, Chen-Hua Yu | 2014-11-25 |
| 8870409 | Light tube | Zhi-Ting Ye, Ming-Chuan Lin, Wen-Chieh Wu | 2014-10-28 |
| 8853830 | System, structure, and method of manufacturing a semiconductor substrate stack | Weng-Jin Wu, Wen-Chih Chiou, Chen-Hua Yu | 2014-10-07 |
| 8847388 | Bump with protection structure | Chen-Hua Yu, An-Jhih Su, Tsang-Jiuh Wu, Wen-Chih Chiou, Shin-Puu Jeng | 2014-09-30 |