Issued Patents All Time
Showing 1–25 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11545392 | Semiconductor component having through-silicon vias | Chen-Hua Yu, Cheng-Hung Chang, Ebin Liao, Hsiang-Yi Wang, Chun Hua Chang +4 more | 2023-01-03 |
| 10784162 | Method of making a semiconductor component having through-silicon vias | Chen-Hua Yu, Cheng-Hung Chang, Ebin Liao, Hsiang-Yi Wang, Chun Hua Chang +4 more | 2020-09-22 |
| 10497619 | Method of manufacturing a semiconductor device including through silicon plugs | Chen-Hua Yu, Hung-Pin Chang, Chien Ling Hwang, Jui-Pin Hung, Yung-Chi Lin | 2019-12-03 |
| 10115634 | Semiconductor component having through-silicon vias and method of manufacture | Chen-Hua Yu, Cheng-Hung Chang, Ebin Liao, Hsiang-Yi Wang, Chun Hua Chang +4 more | 2018-10-30 |
| 10062821 | Light-emitting device | Ding-Yuan Chen, Chen-Hua Yu, Wen-Chih Chiou | 2018-08-28 |
| 10049931 | Method of manufacturing a semiconductor device including through silicon plugs | Chen-Hua Yu, Hung-Pin Chang, Yung-Chi Lin, Jui-Pin Hung, Chien Ling Hwang | 2018-08-14 |
| 9827653 | Screwing accessory device | Jui-Kai Cheng | 2017-11-28 |
| 9698325 | Light-emitting device including reflective layer | Ding-Yuan Chen, Chen-Hua Yu, Wen-Chih Chiou | 2017-07-04 |
| 9448585 | Clamping structure, electronic device and clamping component | Jui-Kai Cheng, Ju-Ching Lin, Ya-Jiun Tzeng, Chu-Ting Yang | 2016-09-20 |
| 9418923 | Semiconductor component having through-silicon vias and method of manufacture | Chen-Hua Yu, Cheng-Hung Chang, Ebin Liao, Hsiang-Yi Wang, Chun Hua Chang +4 more | 2016-08-16 |
| 9373755 | Light-emitting diodes on concave texture substrate | Chen-Hua Yu, Hung-Ta Lin, Wen-Chih Chiou, Ding-Yuan Chen | 2016-06-21 |
| 9305864 | Through silicon via (TSV) isolation structures for noise reduction in 3D integrated circuit | Jaw-Juinn Horng, Chung-Hui Chen, Der-Chyang Yeh, Yung-Chow Peng | 2016-04-05 |
| 9287440 | Method of manufacturing a semiconductor device including through silicon plugs | Chen-Hua Yu, Hung-Pin Chang, Yung-Chi Lin, Jui-Pin Hung, Chien Ling Hwang | 2016-03-15 |
| 9214613 | Method of forming light-generating device including reflective layer | Ding-Yuan Chen, Chen-Hua Yu, Wen-Chih Chiou | 2015-12-15 |
| 9130115 | Light-emitting diode with textured substrate | Chen-Hua Yu, Wen-Chih Chiou, Ding-Yuan Chen, Hung-Ta Lin | 2015-09-08 |
| 8946742 | Semiconductor package with through silicon vias | Chen-Hua Yu, Hung-Pin Chang, Yung-Chi Lin, Jui-Pin Hung, Chien Ling Hwang | 2015-02-03 |
| 8878252 | III-V compound semiconductor epitaxy from a non-III-V substrate | Chen-Hua Yu, Ding-Yuan Chen, Wen-Chih Chiou | 2014-11-04 |
| 8803189 | III-V compound semiconductor epitaxy using lateral overgrowth | Chen-Hua Yu, Ding-Yuan Chen, Wen-Chih Chiou, Hung-Ta Lin | 2014-08-12 |
| 8779445 | Stress-alleviation layer for LED structures | Chen-Hua Yu, Hung-Ta Lin, Ding-Yuan Chen, Wen-Chih Chiou | 2014-07-15 |
| 8716723 | Reflective layer between light-emitting diodes | Ding-Yuan Chen, Chen-Hua Yu, Wen-Chih Chiou | 2014-05-06 |
| 8686474 | III-V compound semiconductor epitaxy from a non-III-V substrate | Ding-Yuan Chen, Wen-Chih Chiou, Chen-Hua Yu | 2014-04-01 |
| 8659033 | Light-emitting diode with textured substrate | Chen-Hua Yu, Wen-Chih Chiou, Ding-Yuan Chen, Hung-Ta Lin | 2014-02-25 |
| 8629465 | Light-emitting diodes on concave texture substrate | Chen-Hua Yu, Hung-Ta Lin, Wen-Chih Chiou, Ding-Yuan Chen | 2014-01-14 |
| 8575725 | Through-silicon vias for semicondcutor substrate and method of manufacture | Chen-Hua Yu, Cheng-Hung Chang, Ebin Liao, Hsiang-Yi Wang, Chun Hua Chang +4 more | 2013-11-05 |
| 8546953 | Through silicon via (TSV) isolation structures for noise reduction in 3D integrated circuit | Jaw-Juinn Horng, Chung-Hui Chen, Der-Chyang Yeh, Yung-Chow Peng | 2013-10-01 |