Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12051672 | Package structure and method of forming the same | Yi-Hsiu Chen, Hong-Ye Shih, Wen-Chih Chiou, Jia-Ling Ko | 2024-07-30 |
| 11545392 | Semiconductor component having through-silicon vias | Chen-Hua Yu, Cheng-Hung Chang, Chia-Lin Yu, Hsiang-Yi Wang, Chun Hua Chang +4 more | 2023-01-03 |
| 10872874 | Bonding apparatus and method of bonding substrates | Chen-Hua Yu, Wen-Chih Chiou | 2020-12-22 |
| 10867831 | Method and apparatus for bonding semiconductor devices | Yan-Zuo Tsai, Yang-Chih Hsueh, Chia-Yin Chen, Fu-Kang Tien, Wen-Chih Chiou | 2020-12-15 |
| 10784162 | Method of making a semiconductor component having through-silicon vias | Chen-Hua Yu, Cheng-Hung Chang, Chia-Lin Yu, Hsiang-Yi Wang, Chun Hua Chang +4 more | 2020-09-22 |
| 10748803 | Method and apparatus for bonding semiconductor devices | Yan-Zuo Tsai, Yang-Chih Hsueh, Chia-Yin Chen, Fu-Kang Tien, Wen-Chih Chiou | 2020-08-18 |
| 10727294 | Semiconductor devices, methods of manufacture thereof, and capacitors | Wen-Chih Chiou, Shin-Puu Jeng | 2020-07-28 |
| 10672737 | Three-dimensional integrated circuit structure and method of manufacturing the same | Yi-Hsiu Chen, Hong-Ye Shih, Wen-Chih Chiou, Jia-Ling Ko | 2020-06-02 |
| 10269611 | Method and apparatus for bonding semiconductor devices | Yan-Zuo Tsai, Yang-Chih Hsueh, Chia-Yin Chen, Fu-Kang Tien, Wen-Chih Chiou | 2019-04-23 |
| 10115634 | Semiconductor component having through-silicon vias and method of manufacture | Chen-Hua Yu, Cheng-Hung Chang, Chia-Lin Yu, Hsiang-Yi Wang, Chun Hua Chang +4 more | 2018-10-30 |
| 9899467 | Semiconductor devices, methods of manufacture thereof, and capacitors | Wen-Chih Chiou, Shin-Puu Jeng | 2018-02-20 |
| 9847256 | Methods for forming a device having a capped through-substrate via structure | Yung-Chi Lin, Yen-Hung Chen, Yin Chen, Ku-Feng Yang, Tsang-Jiuh Wu +1 more | 2017-12-19 |
| 9514986 | Device with capped through-substrate via structure | Yung-Chi Lin, Yen-Hung Chen, Yin Chen, Ku-Feng Yang, Tsang-Jiuh Wu +1 more | 2016-12-06 |
| 9418923 | Semiconductor component having through-silicon vias and method of manufacture | Chen-Hua Yu, Cheng-Hung Chang, Chia-Lin Yu, Hsiang-Yi Wang, Chun Hua Chang +4 more | 2016-08-16 |
| 9263382 | Through substrate via structures and methods of forming the same | Ku-Feng Yang, Tsang-Jiuh Wu, Yi-Hsiu Chen, Yuan-Hung Liu, Wen-Chih Chiou | 2016-02-16 |
| 9087878 | Device with through-silicon via (TSV) and method of forming the same | Chen-Hua Yu, Wen-Chih Chiou, Tsang-Jiuh Wu | 2015-07-21 |
| 8803322 | Through substrate via structures and methods of forming the same | Ku-Feng Yang, Tsang-Jiuh Wu, Yi-Hsiu Chen, Yuan-Hung Liu, Wen-Chih Chiou | 2014-08-12 |
| 8729695 | Wafer level package and a method of forming a wafer level package | Chirayarikathu Veedu Sankarapillai Premachandran, Rakesh Kumar, Nagarajan Ranganathan, Won Kyoung Choi, Yasuyuki Mitsuoka +2 more | 2014-05-20 |
| 8575725 | Through-silicon vias for semicondcutor substrate and method of manufacture | Chen-Hua Yu, Cheng-Hung Chang, Chia-Lin Yu, Hsiang-Yi Wang, Chun Hua Chang +4 more | 2013-11-05 |
| 8525343 | Device with through-silicon via (TSV) and method of forming the same | Chen-Hua Yu, Wen-Chih Chiou, Tsang-Jiuh Wu | 2013-09-03 |
| 8487410 | Through-silicon vias for semicondcutor substrate and method of manufacture | Chen-Hua Yu, Cheng-Hung Chang, Chia-Lin Yu, Hsiang-Yi Wang, Chun Hua Chang +4 more | 2013-07-16 |