Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12322680 | Semiconductor device having backside interconnect structure on through substrate via | Yung-Chi Lin, Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Chia-Yin Chen +3 more | 2025-06-03 |
| 12051672 | Package structure and method of forming the same | Yi-Hsiu Chen, Ebin Liao, Wen-Chih Chiou, Jia-Ling Ko | 2024-07-30 |
| 11823979 | Method of forming semiconductor device having backside interconnect structure on through substrate via | Yung-Chi Lin, Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Chia-Yin Chen +3 more | 2023-11-21 |
| 11056419 | Semiconductor device having backside interconnect structure on through substrate via and method of forming the same | Yung-Chi Lin, Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Chia-Yin Chen +3 more | 2021-07-06 |
| 11004741 | Profile of through via protrusion in 3DIC interconnect | Jiung Wu, Kuan-Liang Lai, Ming-Tsu Chung, Ku-Feng Yang, Tsang-Jiuh Wu +3 more | 2021-05-11 |
| 10672737 | Three-dimensional integrated circuit structure and method of manufacturing the same | Yi-Hsiu Chen, Ebin Liao, Wen-Chih Chiou, Jia-Ling Ko | 2020-06-02 |
| 10566237 | Profile of through via protrusion in 3DIC interconnect | Jiung Wu, Kuan-Liang Lai, Ming-Tsu Chung, Ku-Feng Yang, Tsang-Jiuh Wu +3 more | 2020-02-18 |
| 10510641 | Semiconductor device having backside interconnect structure on through substrate via and method of forming the same | Yung-Chi Lin, Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Chia-Yin Chen +3 more | 2019-12-17 |
| 10163705 | Profile of through via protrusion in 3DIC interconnect | Jiung Wu, Kuan-Liang Lai, Ming-Tsu Chung, Ku-Feng Yang, Tsang-Jiuh Wu +3 more | 2018-12-25 |
| 10074595 | Self-alignment for redistribution layer | Ku-Feng Yang, Ming-Tsu Chung, Jiung Wu, Chen-Yu Tsai, Hsin-Yu Chen +2 more | 2018-09-11 |
| 9786580 | Self-alignment for redistribution layer | Ku-Feng Yang, Ming-Tsu Chung, Jiung Wu, Chen-Yu Tsai, Hsin-Yu Chen +2 more | 2017-10-10 |
| 9449898 | Semiconductor device having backside interconnect structure through substrate via and method of forming the same | Yung-Chi Lin, Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Chia-Yin Chen +3 more | 2016-09-20 |