Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12322680 | Semiconductor device having backside interconnect structure on through substrate via | Yung-Chi Lin, Hsin-Yu Chen, Ming-Tsu Chung, Hong-Ye Shih, Chia-Yin Chen +3 more | 2025-06-03 |
| 11823979 | Method of forming semiconductor device having backside interconnect structure on through substrate via | Yung-Chi Lin, Hsin-Yu Chen, Ming-Tsu Chung, Hong-Ye Shih, Chia-Yin Chen +3 more | 2023-11-21 |
| 11056419 | Semiconductor device having backside interconnect structure on through substrate via and method of forming the same | Yung-Chi Lin, Hsin-Yu Chen, Ming-Tsu Chung, Hong-Ye Shih, Chia-Yin Chen +3 more | 2021-07-06 |
| 10510641 | Semiconductor device having backside interconnect structure on through substrate via and method of forming the same | Yung-Chi Lin, Hsin-Yu Chen, Ming-Tsu Chung, Hong-Ye Shih, Chia-Yin Chen +3 more | 2019-12-17 |
| 9842823 | Chip-stacking apparatus having a transport device configured to transport a chip onto a substrate | Chen-Hua Yu, Yi-Hsiu Chen, Wen-Chih Chiou | 2017-12-12 |
| 9449898 | Semiconductor device having backside interconnect structure through substrate via and method of forming the same | Yung-Chi Lin, Hsin-Yu Chen, Ming-Tsu Chung, Hong-Ye Shih, Chia-Yin Chen +3 more | 2016-09-20 |