Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12322680 | Semiconductor device having backside interconnect structure on through substrate via | Yung-Chi Lin, Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Hong-Ye Shih +3 more | 2025-06-03 |
| 11948920 | Semiconductor device and method for manufacturing the same, and semiconductor package | I-Chun Hsu, Yan-Zuo Tsai, Yang-Chih Hsueh, Yung-Chi Lin, Tsang-Jiuh Wu +1 more | 2024-04-02 |
| 11823979 | Method of forming semiconductor device having backside interconnect structure on through substrate via | Yung-Chi Lin, Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Hong-Ye Shih +3 more | 2023-11-21 |
| 11056419 | Semiconductor device having backside interconnect structure on through substrate via and method of forming the same | Yung-Chi Lin, Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Hong-Ye Shih +3 more | 2021-07-06 |
| 10867831 | Method and apparatus for bonding semiconductor devices | Yan-Zuo Tsai, Yang-Chih Hsueh, Fu-Kang Tien, Ebin Liao, Wen-Chih Chiou | 2020-12-15 |
| 10748803 | Method and apparatus for bonding semiconductor devices | Yan-Zuo Tsai, Yang-Chih Hsueh, Fu-Kang Tien, Ebin Liao, Wen-Chih Chiou | 2020-08-18 |
| 10510641 | Semiconductor device having backside interconnect structure on through substrate via and method of forming the same | Yung-Chi Lin, Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Hong-Ye Shih +3 more | 2019-12-17 |
| 10269611 | Method and apparatus for bonding semiconductor devices | Yan-Zuo Tsai, Yang-Chih Hsueh, Fu-Kang Tien, Ebin Liao, Wen-Chih Chiou | 2019-04-23 |
| 9616697 | Blanket for transferring a paste image from an engraved plate to a substrate | Chuan-Jen FU, Hsin-Jung Lin, Ruoh-Huey Uang | 2017-04-11 |
| 9449898 | Semiconductor device having backside interconnect structure through substrate via and method of forming the same | Yung-Chi Lin, Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Hong-Ye Shih +3 more | 2016-09-20 |
| 9269677 | Fabrication method of packaging substrate | Yu-Ching Liu, Yueh-Chiung Chang, Yu-Po Wang | 2016-02-23 |
| 8901729 | Semiconductor package, packaging substrate and fabrication method thereof | Yu-Ching Liu, Yueh-Chiung Chang, Yu-Po Wang | 2014-12-02 |
| 4929728 | Process for preparing 3-(1H-tetrazol-5-yl)-4(3H)-quinazolinone | Ji-Wang Chern, Kang-Chien Liu | 1990-05-29 |