Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9856395 | Coating composition, method for coating a substrate using the same and pipeline | Yu-Tien CHEN, Po-Nien Tsai | 2018-01-02 |
| 9616697 | Blanket for transferring a paste image from an engraved plate to a substrate | Chia-Yin Chen, Chuan-Jen FU, Hsin-Jung Lin | 2017-04-11 |
| 9617373 | Curable resin composition, article, and method for fabricating the same | Yu-Tien CHEN, Po-Nien Tsai | 2017-04-11 |
| 9573405 | Method and blanket for transferring a paste image from engraved plate to substrate | Chuan-Jen FU, Wei-Ting Hong, Hsin-Jung Lin | 2017-02-21 |
| 8802557 | Micro bump and method for forming the same | Yi Cheng | 2014-08-12 |
| 8426964 | Micro bump and method for forming the same | Yi Cheng | 2013-04-23 |
| 8323553 | Method for manufacturing a substrate with surface structure by employing photothermal effect | Tzong-Ming Lee, Kuo-Chan Chiou, Yu Wang, Yi Cheng | 2012-12-04 |
| 7605474 | Structure of polymer-matrix conductive film and method for fabricating the same | Yu-Chih Chen, Ren Jen Lin, Syh-Yuh Cheng | 2009-10-20 |
| 7598609 | Structure of polymer-matrix conductive film and method for fabricating the same | Yu-Chih Chen, Ren Jay Lin, Syh-Yuh Cheng | 2009-10-06 |
| 7526861 | Method for fabricating structure of polymer-matrix conductive film | Yu-Chih Chen, Ren Jen Lin, Syh-Yuh Cheng | 2009-05-05 |
| 7163885 | Method of migrating and fixing particles in a solution to bumps on a chip | Yu-Chih Chen, Yu-Hua Chen | 2007-01-16 |
| 6989325 | Self-assembled nanometer conductive bumps and method for fabricating | Yu-Hua Chen | 2006-01-24 |
| 6539624 | Method for forming wafer level package | Ling-Chen Kung, Kuo-Chuan Chen, Szu-Wei Lu | 2003-04-01 |
| 6440836 | Method for forming solder bumps on flip chips and devices formed | Szu-Wei Lu, Ling-Chen Kung, Hsu-Tien Hu | 2002-08-27 |
| 6268114 | Method for forming fine-pitched solder bumps | Ying-Nan Wen, Ling-Chen Kung, Szu-Wei Lu | 2001-07-31 |
| 6179200 | Method for forming solder bumps of improved height and devices formed | Ling-Chen Kung, Hsu-Tien Hu, Szu-Wei Lu, Chun-Yi Kuo | 2001-01-30 |