Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7579694 | Electronic devices including offset conductive bumps | Jong-Rong Jan, Tsai-Hua Lu, Sao-Ling Chiu | 2009-08-25 |
| 7081404 | Methods of selectively bumping integrated circuit substrates and related structures | Jong-Rong Jan, Tsai-Hua Lu, Sao-Ling Chiu | 2006-07-25 |
| 6539624 | Method for forming wafer level package | Kuo-Chuan Chen, Ruoh-Huey Uang, Szu-Wei Lu | 2003-04-01 |
| 6440836 | Method for forming solder bumps on flip chips and devices formed | Szu-Wei Lu, Ruoh-Huey Uang, Hsu-Tien Hu | 2002-08-27 |
| 6277669 | Wafer level packaging method and packages formed | Jyh-Rong Lin, Kuo-Chuan Chen | 2001-08-21 |
| 6268114 | Method for forming fine-pitched solder bumps | Ying-Nan Wen, Szu-Wei Lu, Ruoh-Huey Uang | 2001-07-31 |
| 6197613 | Wafer level packaging method and devices formed | Tsung-Yao Chu | 2001-03-06 |
| 6179200 | Method for forming solder bumps of improved height and devices formed | Hsu-Tien Hu, Ruoh-Huey Uang, Szu-Wei Lu, Chun-Yi Kuo | 2001-01-30 |