Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6566752 | Bonding pad and method for manufacturing it | Chin-Chiu Hsia, Bing-Yue Tsui, Tsung-Ju Yang | 2003-05-20 |
| 6459150 | Electronic substrate having an aperture position through a substrate, conductive pads, and an insulating layer | Enboa Wu, Hsin-Chien Huang, Rong-Shen Lee | 2002-10-01 |
| 6433427 | Wafer level package incorporating dual stress buffer layers for I/O redistribution and method for fabrication | Enboa Wu, Hsin-Chien Huang, Chung-Tao Chang | 2002-08-13 |
| 6426555 | Bonding pad and method for manufacturing it | Chin-Chiu Hsia, Bing-Yue Tsui, Tsung-Ju Yang | 2002-07-30 |
| 6365498 | Integrated process for I/O redistribution and passive components fabrication and devices formed | Ying-Nan Wen, Szu-Wei Lu | 2002-04-02 |
| 6312974 | Simultaneous bumping/bonding process utilizing edge-type conductive pads and device fabricated | En-Boa Wu, Hsin-Chien Huang | 2001-11-06 |
| 6197613 | Wafer level packaging method and devices formed | Ling-Chen Kung | 2001-03-06 |
| 5893731 | Method for fabricating low cost integrated resistor capacitor combinations | Chang Shu Lee | 1999-04-13 |