Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8672512 | Omni reflective optics for wide angle emission LED light bulb | Li Zhou, Kai Wu | 2014-03-18 |
| 8558254 | High reliability high voltage vertical LED arrays | Wing Yan Ho | 2013-10-15 |
| 8013347 | Remote control lighting assembly and use thereof | Zhikuan Zhang, Ming Lu, Lydia Lap Wai Leung, Kelvin Li | 2011-09-06 |
| 7943052 | Method for self-assembling microstructures | CHIA-SHOU CHANG | 2011-05-17 |
| 7754530 | Thermal enhanced low profile package structure and method for fabricating the same | Shou-Lung Chen | 2010-07-13 |
| 7511365 | Thermal enhanced low profile package structure | Shou-Lung Chen | 2009-03-31 |
| 7482632 | LED assembly and use thereof | Ming Lu, Kai Wu, Zhikuan Zhang | 2009-01-27 |
| 7474287 | Light emitting device | Ming Lu, Geoffrey Wan Tai Shuy | 2009-01-06 |
| 7351609 | Method for wafer level package of sensor chip | Rou-Ching Yang | 2008-04-01 |
| 7271020 | Light emitting diode covered with a reflective layer and method for fabricating the same | Xing-Xiang Liu, CHIA-SHOU CHANG | 2007-09-18 |
| 7203426 | Optical subassembly of optical transceiver | Ying-Ching Shih | 2007-04-10 |
| 7013066 | Tunable long period fiber grating structure and fabrication method | Rou-Ching Yang, Kuo-Ching San | 2006-03-14 |
| 6459150 | Electronic substrate having an aperture position through a substrate, conductive pads, and an insulating layer | Tsung-Yao Chu, Hsin-Chien Huang, Rong-Shen Lee | 2002-10-01 |
| 6433427 | Wafer level package incorporating dual stress buffer layers for I/O redistribution and method for fabrication | Tsung-Yao Chu, Hsin-Chien Huang, Chung-Tao Chang | 2002-08-13 |