Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6485198 | Optoelectronic transceiver having integrated optical and electronic components | Bi-Chu Wu, Chien-Chou Chen, Chih-Hsiang Ko | 2002-11-26 |
| 6444561 | Method for forming solder bumps for flip-chip bonding by using perpendicularly laid masking strips | Chia-Chung Wang, Kuo-Chuan Chen | 2002-09-03 |
| 6433427 | Wafer level package incorporating dual stress buffer layers for I/O redistribution and method for fabrication | Enboa Wu, Tsung-Yao Chu, Hsin-Chien Huang | 2002-08-13 |
| 6316953 | Contact type prober automatic alignment | Steven Yang, Jane Huei-Chen Chan, Hsiu-Tsang Lee | 2001-11-13 |
| 6218726 | Built-in stress pattern on IC dies and method of forming | Chia-Chung Wang, Hsin-Chien Huang | 2001-04-17 |
| 6049216 | Contact type prober automatic alignment | Steven Yang, Jane Chang, Hsiu-Tsang Lee | 2000-04-11 |
| 5903168 | Switchable MCM CMOS I/O buffers | Jyh-Ren Yang, Ruey-Wen Chien | 1999-05-11 |