Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6851168 | Collar removing clamp for HDP chamber | Wen-Shan Chang, Jung-Chang Chen, Shih-Chang Hsu, Li-Chung Wang, Cheng-Chia Kuo +4 more | 2005-02-08 |
| 6539624 | Method for forming wafer level package | Ling-Chen Kung, Ruoh-Huey Uang, Szu-Wei Lu | 2003-04-01 |
| 6444561 | Method for forming solder bumps for flip-chip bonding by using perpendicularly laid masking strips | Chia-Chung Wang, Chung-Tao Chang | 2002-09-03 |
| 6358836 | Wafer level package incorporating elastomeric pads in dummy plugs | Szu-Wei Lu, Jyh-Rong Lin, Ruoh-Huey Wang, Hsu-Tien Hu, Hsin-Chien Huang | 2002-03-19 |
| 6277669 | Wafer level packaging method and packages formed | Ling-Chen Kung, Jyh-Rong Lin | 2001-08-21 |
| 6137708 | Method for forming multi-chip sensing device and device formed | Yuh-Jiuan Lin, Ming-Chang Shih, Tzong-Zeng Wuh | 2000-10-24 |
| 5945774 | Open package for crystal oscillator chips | Ming-Chang Shih | 1999-08-31 |